Kiyoshi Asai

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Toyama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for producing heat-radiating subst...
- Patent number 6,926,861
- Issue date Aug 9, 2005
- Tokyo Tungsten Co., Ltd.
- Norio Hirayama
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor package and method for producing heat-radiating subst...
- Patent number 6,693,353
- Issue date Feb 17, 2004
- Tokyo Tungsten Co., Ltd.
- Norio Hirayama
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat sink substrate consisting essentially of copper and molybdenum...
- Patent number 6,475,429
- Issue date Nov 5, 2002
- Tokyo Tungsten Co., Ltd.
- Mitsuo Osada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat sink substrate consisting essentially of copper and molybdenum...
- Patent number 6,271,585
- Issue date Aug 7, 2001
- Tokyo Tungsten Co., Ltd.
- Mitsuo Osada
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package and method for producing heat-radiating subst...
- Publication number 20040056352
- Publication date Mar 25, 2004
- TOKYO TUNGSTEN CO., LTD.
- Norio Hirayama
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Heat sink substrate consisting essentially of copper and molybdenum...
- Publication number 20020017346
- Publication date Feb 14, 2002
- Mitsuo Osada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...