Kiyoshi Demizu

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Silicon semiconductor substrate and its manufacturing method
- Patent number 7,411,274
- Issue date Aug 12, 2008
- Shin-Etsu Handotai Co., Ltd.
- Hideki Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer and method of producing bonded wafer
- Patent number 7,315,064
- Issue date Jan 1, 2008
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer and method of producing bonded wafer
- Patent number 7,052,974
- Issue date May 30, 2006
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and device for semiconductor device manufacturi...
- Patent number 6,787,797
- Issue date Sep 7, 2004
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Demizu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Silicon semiconductor substrate and its manufacturing method
- Publication number 20060131553
- Publication date Jun 22, 2006
- Hideki Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded wafer and method of producing bonded wafer
- Publication number 20060099791
- Publication date May 11, 2006
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pasted wafer and method for producing pasted wafer
- Publication number 20050003648
- Publication date Jan 6, 2005
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and device for semiconductor device manufacturi...
- Publication number 20020167006
- Publication date Nov 14, 2002
- Kiyoshi Demizu
- H01 - BASIC ELECTRIC ELEMENTS