Kiyoshi Hasegawa

Person

Yuki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate for mounting semiconductor chip and method for producing...
- Patent number 8,997,341
- Issue date Apr 7, 2015
- Hitachi Chemical Company, Ltd.
- Yoshinori Ejiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Patent number 8,815,334
- Issue date Aug 26, 2014
- Hitachi Chemical Co., Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting terminal, semiconductor package using connecting termina...
- Patent number 8,426,742
- Issue date Apr 23, 2013
- Hitachi Chemical Company, Ltd.
- Yoshinori Ejiri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation method of metal layer on resin layer, printed wiring boar...
- Patent number 7,964,289
- Issue date Jun 21, 2011
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Patent number 7,862,889
- Issue date Jan 4, 2011
- Hitachi Chemical Co., Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation method of metal layer on resin layer
- Patent number 7,818,877
- Issue date Oct 26, 2010
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Patent number 7,629,045
- Issue date Dec 8, 2009
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation method of metal layer on resin layer, printed wiring boar...
- Patent number 7,615,277
- Issue date Nov 10, 2009
- Hitachi Chemical Company, Ltd.
- Kenji Takai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless gold plating solution and method for electroless plating
- Patent number 6,811,828
- Issue date Nov 2, 2004
- Hitachi Chemical Co., Ltd.
- Akio Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal foil for printed wiring board and production thereof
- Patent number 5,689,879
- Issue date Nov 25, 1997
- Hitachi Chemical Company, Ltd.
- Naoyuki Urasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foil for printed wiring board and production thereof
- Patent number 5,403,672
- Issue date Apr 4, 1995
- Hitachi Chemical Co., Ltd.
- Naoyuki Urasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing printed wiring board
- Patent number 5,309,632
- Issue date May 10, 1994
- Hitachi Chemical Co., Ltd.
- Hiroshi Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING...
- Publication number 20120234584
- Publication date Sep 20, 2012
- Hitachi Chemical Company, Ltd.
- Yoshinori Ejiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING TERMINAL, SEMICONDUCTOR PACKAGE USING CONNECTING TERMINA...
- Publication number 20100071940
- Publication date Mar 25, 2010
- Hitachi Chemical Company, Ltd.
- Yoshinori Ejiri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...
- Publication number 20100051338
- Publication date Mar 4, 2010
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...
- Publication number 20100044086
- Publication date Feb 25, 2010
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...
- Publication number 20090145766
- Publication date Jun 11, 2009
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...
- Publication number 20080138505
- Publication date Jun 12, 2008
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...
- Publication number 20070277373
- Publication date Dec 6, 2007
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Adhesion assisting agent-bearing metal foil, printed wiring board,...
- Publication number 20050202261
- Publication date Sep 15, 2005
- Kenji Takai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Formation method of metal layer on resin layer, printed wiring boar...
- Publication number 20050106370
- Publication date May 19, 2005
- Kenji Takai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless gold plating solution and method for electroless plating
- Publication number 20040028833
- Publication date Feb 12, 2004
- Akio Takahashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kiyoshi Hasegawa

Person

Patents Grantslast 30 patents

Substrate for mounting semiconductor chip and method for producing...

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Connecting terminal, semiconductor package using connecting termina...

Formation method of metal layer on resin layer, printed wiring boar...

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Formation method of metal layer on resin layer

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Formation method of metal layer on resin layer, printed wiring boar...

Electroless gold plating solution and method for electroless plating

Metal foil for printed wiring board and production thereof

Metal foil for printed wiring board and production thereof

Process for producing printed wiring board

Patents Applicationslast 30 patents

SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING...

CONNECTING TERMINAL, SEMICONDUCTOR PACKAGE USING CONNECTING TERMINA...

ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...

FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...

ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD,...

FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...

FORMATION METHOD OF METAL LAYER ON RESIN LAYER, PRINTED WIRING BOAR...

Adhesion assisting agent-bearing metal foil, printed wiring board,...

Formation method of metal layer on resin layer, printed wiring boar...

Electroless gold plating solution and method for electroless plating