Kiyoshi Ishida

Person

Chiyoda-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Array antenna apparatus and method for fabricating same
- Patent number 11,211,710
- Issue date Dec 28, 2021
- Mitsubishi Electric Corporation
- Yoichi Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave device and antenna for improving heat dissipation
- Patent number 11,205,623
- Issue date Dec 21, 2021
- Mitsubishi Electric Corporation
- Yukinobu Tarui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave device and antenna for improving heat dissipation
- Patent number 11,152,310
- Issue date Oct 19, 2021
- Mitsubishi Electric Corporation
- Yukinobu Tarui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having electromagnetic wave absorbing layer wi...
- Patent number 11,121,095
- Issue date Sep 14, 2021
- Mitsubishi Electric Corporation
- Tomohiro Tanishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,114,386
- Issue date Sep 7, 2021
- Mitsubishi Electric Corporation
- Kiyoshi Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and module
- Patent number 10,964,631
- Issue date Mar 30, 2021
- Mitsubishi Electric Corporation
- Hideharu Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and method of manufacturing the same
- Patent number 10,916,520
- Issue date Feb 9, 2021
- Mitsubishi Electric Corporation
- Kiyoshi Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,756,026
- Issue date Aug 25, 2020
- Mitsubishi Electric Corporation
- Kiyoshi Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency circuit
- Patent number 10,512,153
- Issue date Dec 17, 2019
- Mitsubishi Electric Corporation
- Hidenori Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,396,039
- Issue date Aug 27, 2019
- Mitsubishi Electric Corporation
- Hiroyuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount high-frequency circuit
- Patent number 9,691,722
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Takeshi Yuasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic functionality generating mechanism for network connecting...
- Patent number 7,660,266
- Issue date Feb 9, 2010
- Internet Initiative Japan, Inc.
- Kiyoshi Ishida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated management system and method for network connection mean...
- Patent number 7,555,007
- Issue date Jun 30, 2009
- Internet Initiative Japan, Inc.
- Kiyoshi Ishida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Resin-sealed semiconductor device
- Patent number 6,753,596
- Issue date Jun 22, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROWAVE DEVICE AND ANTENNA
- Publication number 20210233865
- Publication date Jul 29, 2021
- Mitsubishi Electric Corporation
- Yukinobu TARUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE DEVICE AND ANTENNA
- Publication number 20210134733
- Publication date May 6, 2021
- MITSUBISHI ELECTRIC CORPORATION
- Yukinobu TARUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210111130
- Publication date Apr 15, 2021
- MITSUBISHI ELECTRIC CORPORATION
- Tomohiro TANISHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Array Antenna Apparatus and Method For Fabricating Same
- Publication number 20200235478
- Publication date Jul 23, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Yoichi KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MODULE
- Publication number 20200126896
- Publication date Apr 23, 2020
- Mitsubishi Electric Corporation
- Hideharu YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20200058598
- Publication date Feb 20, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Kiyoshi ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20190295959
- Publication date Sep 26, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Kiyoshi ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY CIRCUIT
- Publication number 20190159332
- Publication date May 23, 2019
- Mitsubishi Electric Corporation
- Hidenori ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180158794
- Publication date Jun 7, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Kiyoshi ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170330838
- Publication date Nov 16, 2017
- Mitsubishi Electric Corporation
- Hiroyuki MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT HIGH-FREQUENCY CIRCUIT
- Publication number 20170077049
- Publication date Mar 16, 2017
- Mitsubishi Electric Corporation
- Takeshi YUASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC FUNCTIONALITY GENERATING MECHANISM FOR NETWORK CONNECTING...
- Publication number 20070106777
- Publication date May 10, 2007
- INTERNET INITIATIVE JAPAN INC.
- Kiyoshi ISHIDA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Integrated management system and method for network connection mean...
- Publication number 20060109797
- Publication date May 25, 2006
- Internet Initiative Japan, Inc.
- Kiyoshi Ishida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RESIN-SEALED SEMICONDUCTOR DEVICE
- Publication number 20040108602
- Publication date Jun 10, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H01 - BASIC ELECTRIC ELEMENTS

Kiyoshi Ishida

Person

Patents Grantslast 30 patents

Array antenna apparatus and method for fabricating same

Microwave device and antenna for improving heat dissipation

Microwave device and antenna for improving heat dissipation

Semiconductor device having electromagnetic wave absorbing layer wi...

Semiconductor device and method of manufacturing the same

Semiconductor package and module

Semiconductor device, and method of manufacturing the same

Semiconductor device and method of manufacturing the same

High frequency circuit

Semiconductor package

Surface mount high-frequency circuit

Automatic functionality generating mechanism for network connecting...

Integrated management system and method for network connection mean...

Resin-sealed semiconductor device

Patents Applicationslast 30 patents

MICROWAVE DEVICE AND ANTENNA

MICROWAVE DEVICE AND ANTENNA

SEMICONDUCTOR DEVICE

Array Antenna Apparatus and Method For Fabricating Same

SEMICONDUCTOR PACKAGE AND MODULE

Semiconductor Device and Method of Manufacturing the Same

Semiconductor Device and Method of Manufacturing the Same

HIGH FREQUENCY CIRCUIT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SURFACE MOUNT HIGH-FREQUENCY CIRCUIT

AUTOMATIC FUNCTIONALITY GENERATING MECHANISM FOR NETWORK CONNECTING...

Integrated management system and method for network connection mean...

RESIN-SEALED SEMICONDUCTOR DEVICE