Kiyoshi Mitani

Person

Takasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded substrate and manufacturing method thereof
- Patent number 8,900,971
- Issue date Dec 2, 2014
- Shin-Etsu Handotai Co., Ltd.
- Tsuyoshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded substrate having an insulator layer...
- Patent number 8,877,609
- Issue date Nov 4, 2014
- Shin-Etsu Handotai Co., Ltd.
- Tsuyoshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon on insulator (SOI) wafer and process for producing same
- Patent number 8,703,580
- Issue date Apr 22, 2014
- Shin-Etsu Chemical Co., Ltd.
- Atsuo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having multilayer film and method to reuse...
- Patent number 8,575,722
- Issue date Nov 5, 2013
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating oxide dielectric breakdown voltage of a silic...
- Patent number 8,551,246
- Issue date Oct 8, 2013
- Shin-Etsu Handotai Co., Ltd.
- Fumio Tahara
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Silicon on insulator (SOI) wafer and process for producing same
- Patent number 8,236,667
- Issue date Aug 7, 2012
- Shin-Etsu Chemical Co., Ltd.
- Atsuo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor wafer
- Patent number 7,959,731
- Issue date Jun 14, 2011
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning a multilayer substrate and method for bonding s...
- Patent number 7,608,548
- Issue date Oct 27, 2009
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of bonded wafer
- Patent number 7,601,613
- Issue date Oct 13, 2009
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI wafer and method for producing the same
- Patent number 7,560,313
- Issue date Jul 14, 2009
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor wafer
- Patent number 7,550,309
- Issue date Jun 23, 2009
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating bonded wafer
- Patent number 7,531,425
- Issue date May 12, 2009
- Shin-Etsu Handotai Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing SOI wafer and SOI wafer
- Patent number 7,524,744
- Issue date Apr 28, 2009
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating SOI wafer
- Patent number 7,320,929
- Issue date Jan 22, 2008
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer and method of producing bonded wafer
- Patent number 7,315,064
- Issue date Jan 1, 2008
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treating substrates for microelectronics and substrates...
- Patent number 7,235,427
- Issue date Jun 26, 2007
- S.O.I. Tec Silicon on Insulator Technologies
- Thierry Barge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing SOI wafer and SOI wafer
- Patent number 7,176,102
- Issue date Feb 13, 2007
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing SOI wafer and SOI wafer
- Patent number 7,091,107
- Issue date Aug 15, 2006
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating SOI wafer
- Patent number 7,084,046
- Issue date Aug 1, 2006
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer and method of producing bonded wafer
- Patent number 7,052,974
- Issue date May 30, 2006
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI wafer producing method, and wafer separating jig
- Patent number 6,998,329
- Issue date Feb 14, 2006
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method for bonded substrates
- Patent number 6,959,854
- Issue date Nov 1, 2005
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treating substrates for microelectronics and substrates...
- Patent number 6,902,988
- Issue date Jun 7, 2005
- S.O.I.Tec Silicon on Insulator Technologies S.A.
- Thierry Barge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer and bonded wafer
- Patent number 6,900,113
- Issue date May 31, 2005
- Shin-Etsu Handotai Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonding wafer
- Patent number 6,884,696
- Issue date Apr 26, 2005
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing SOI wafer and SOI wafer
- Patent number 6,846,718
- Issue date Jan 25, 2005
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer producing method and bonded wafer
- Patent number 6,797,632
- Issue date Sep 28, 2004
- Shin-Etsu Handotai Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method for SOI wafer and SOI wafer
- Patent number 6,784,494
- Issue date Aug 31, 2004
- Shin-Etsu Handotai, Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reclaiming delaminated wafer and reclaimed delaminated w...
- Patent number 6,720,640
- Issue date Apr 13, 2004
- Shin-Etsu Handotai Co., Ltd.
- Susumu Kuwabara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a bonded wafer and the bonded wafer
- Patent number 6,716,722
- Issue date Apr 6, 2004
- Shin-Etsu Handotai Co., Ltd.
- Jun-ichiro Furihata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING BONDED SUBSTRATE HAVING AN INSULATOR LAYER...
- Publication number 20140120695
- Publication date May 1, 2014
- Shin-Etsu Handotai Co., Ltd.
- Tsuyoshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20130341763
- Publication date Dec 26, 2013
- Shin-Etsu Handotai Co., Ltd.
- Tsuyoshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER HAVING MULTILAYER FILM, METHOD FOR PRODUCING TH...
- Publication number 20110266655
- Publication date Nov 3, 2011
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON SINGLE CRYSTAL WAFER AND METHOD FOR MANUFACTURING SILICON S...
- Publication number 20110045246
- Publication date Feb 24, 2011
- Shin-Etsu Handotai Co., Ltd.
- Fumio Tahara
- C30 - CRYSTAL GROWTH
Information Patent Application
Method for Manufacturing Bonded Substrate
- Publication number 20090203167
- Publication date Aug 13, 2009
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON ON INSULATOR (SOI) WAFER AND PROCESS FOR PRODUCING SAME
- Publication number 20080305317
- Publication date Dec 11, 2008
- Shin-Etsu Chemical Co., Ltd.
- ATSUO ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON ON INSULATOR (SOI) WAFER AND PROCESS FOR PRODUCING SAME
- Publication number 20080305318
- Publication date Dec 11, 2008
- Shin-Etsu Chemical Co., Ltd.
- Atsuo Ito
- C30 - CRYSTAL GROWTH
Information Patent Application
SILICON ON INSULATOR (SOI) WAFER AND PROCESS FOR PRODUCING SAME
- Publication number 20080299376
- Publication date Dec 4, 2008
- Shin-Etsu Chemical Co., Ltd.
- ATSUO ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing Method for Bonded Wafer
- Publication number 20080286937
- Publication date Nov 20, 2008
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Producing Semiconductor Wafer
- Publication number 20080138959
- Publication date Jun 12, 2008
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Semiconductor Wafer
- Publication number 20080003785
- Publication date Jan 3, 2008
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- C30 - CRYSTAL GROWTH
Information Patent Application
SOI wafer and method for producing the same
- Publication number 20070054459
- Publication date Mar 8, 2007
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer substrate cleaning method, substrate bonding method, and...
- Publication number 20070023066
- Publication date Feb 1, 2007
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a semiconductor wafer
- Publication number 20060185581
- Publication date Aug 24, 2006
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- C30 - CRYSTAL GROWTH
Information Patent Application
Bonded wafer and method of producing bonded wafer
- Publication number 20060099791
- Publication date May 11, 2006
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing soi wafer and soi wafer
- Publication number 20060051945
- Publication date Mar 9, 2006
- SHIN-ETSU HANDOTAI CO,. LTD.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soi wafer manufacturing method
- Publication number 20060040469
- Publication date Feb 23, 2006
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for treating substrates for microelectronics and substrates...
- Publication number 20050208322
- Publication date Sep 22, 2005
- S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES S.A.
- Thierry Barge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing soi wafer and soi wafer
- Publication number 20050118789
- Publication date Jun 2, 2005
- SHIN-ETSU HANDOTAI CO.,LTD
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing SOI wafer and SOI wafer
- Publication number 20050042840
- Publication date Feb 24, 2005
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production method for soi wafer
- Publication number 20050014346
- Publication date Jan 20, 2005
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pasted wafer and method for producing pasted wafer
- Publication number 20050003648
- Publication date Jan 6, 2005
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing SOI wafer and thus-manufactured SOI wafer
- Publication number 20040259327
- Publication date Dec 23, 2004
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soi wafer and its manufacturing method
- Publication number 20040219370
- Publication date Nov 4, 2004
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soi wafer producing method, and wafer separating jig
- Publication number 20040180511
- Publication date Sep 16, 2004
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing SOI wafer and SOI wafer
- Publication number 20040166650
- Publication date Aug 26, 2004
- SHIN-ETSU HANDOTAI CO., LTD.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for treating substrates for microelectronics and substrates...
- Publication number 20040115905
- Publication date Jun 17, 2004
- Thierry Barge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing a bonded wafer and the bonded wafer
- Publication number 20040081805
- Publication date Apr 29, 2004
- Shin-Etsu Handotai Co., Ltd.
- Jun-Ichiro Furihata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing SOI wafer and SOI wafer
- Publication number 20040063298
- Publication date Apr 1, 2004
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production method for bonded substrates
- Publication number 20040035525
- Publication date Feb 26, 2004
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS

Kiyoshi Mitani

Person

Patents Grantslast 30 patents

Bonded substrate and manufacturing method thereof

Method for manufacturing bonded substrate having an insulator layer...

Silicon on insulator (SOI) wafer and process for producing same

Semiconductor substrate having multilayer film and method to reuse...

Method for evaluating oxide dielectric breakdown voltage of a silic...

Silicon on insulator (SOI) wafer and process for producing same

Method for producing semiconductor wafer

Method for cleaning a multilayer substrate and method for bonding s...

Manufacturing method of bonded wafer

SOI wafer and method for producing the same

Method for producing semiconductor wafer

Method of fabricating bonded wafer

Method of producing SOI wafer and SOI wafer

Method of fabricating SOI wafer

Bonded wafer and method of producing bonded wafer

Method for treating substrates for microelectronics and substrates...

Method for producing SOI wafer and SOI wafer

Method for producing SOI wafer and SOI wafer

Method of fabricating SOI wafer

Bonded wafer and method of producing bonded wafer

SOI wafer producing method, and wafer separating jig

Production method for bonded substrates

Method for treating substrates for microelectronics and substrates...

Method for producing bonded wafer and bonded wafer

Method for producing bonding wafer

Method for producing SOI wafer and SOI wafer

Bonded wafer producing method and bonded wafer

Production method for SOI wafer and SOI wafer

Method for reclaiming delaminated wafer and reclaimed delaminated w...

Method of producing a bonded wafer and the bonded wafer

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING BONDED SUBSTRATE HAVING AN INSULATOR LAYER...

BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR WAFER HAVING MULTILAYER FILM, METHOD FOR PRODUCING TH...

SILICON SINGLE CRYSTAL WAFER AND METHOD FOR MANUFACTURING SILICON S...

Method for Manufacturing Bonded Substrate

SILICON ON INSULATOR (SOI) WAFER AND PROCESS FOR PRODUCING SAME

SILICON ON INSULATOR (SOI) WAFER AND PROCESS FOR PRODUCING SAME

SILICON ON INSULATOR (SOI) WAFER AND PROCESS FOR PRODUCING SAME

Manufacturing Method for Bonded Wafer

Method For Producing Semiconductor Wafer

Method for Producing Semiconductor Wafer

SOI wafer and method for producing the same

Multilayer substrate cleaning method, substrate bonding method, and...

Method for producing a semiconductor wafer

Bonded wafer and method of producing bonded wafer

Method for manufacturing soi wafer and soi wafer

Soi wafer manufacturing method

Method for treating substrates for microelectronics and substrates...

Method of producing soi wafer and soi wafer

Method for producing SOI wafer and SOI wafer

Production method for soi wafer

Pasted wafer and method for producing pasted wafer

Method for manufacturing SOI wafer and thus-manufactured SOI wafer

Soi wafer and its manufacturing method

Soi wafer producing method, and wafer separating jig

Method for producing SOI wafer and SOI wafer

Method for treating substrates for microelectronics and substrates...

Method of producing a bonded wafer and the bonded wafer

Method for producing SOI wafer and SOI wafer

Production method for bonded substrates