KIYOSHI OI

Person

NAGANO-SHI, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded printed circuit board
- Patent number 12,185,470
- Issue date Dec 31, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,817,381
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite wiring substrate and semiconductor device
- Patent number 11,706,877
- Issue date Jul 18, 2023
- Shinko Electric Industries Co., Ltd.
- Shota Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,997,450
- Issue date Jun 12, 2018
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, semiconductor device, and method for manufacturin...
- Patent number 9,859,201
- Issue date Jan 2, 2018
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, semiconductor device, method of manufacturing wir...
- Patent number 9,622,347
- Issue date Apr 11, 2017
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,530,744
- Issue date Dec 27, 2016
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,307,641
- Issue date Apr 5, 2016
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,048,331
- Issue date Jun 2, 2015
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packaging apparatus and electronic packaging method
- Patent number 8,720,519
- Issue date May 13, 2014
- Shinko Electric Industries Co., Ltd.
- Takatoyo Yamakami
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device having electronic component in through part, e...
- Patent number 8,669,653
- Issue date Mar 11, 2014
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and electronic component device
- Patent number 8,334,461
- Issue date Dec 18, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichi Taguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of semiconductor device having underfill resin...
- Patent number 8,138,018
- Issue date Mar 20, 2012
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module substrate including optical transmission mechanism and metho...
- Patent number 8,111,954
- Issue date Feb 7, 2012
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- G02 - OPTICS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 8,017,503
- Issue date Sep 13, 2011
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor device and method of manufacturing the same
- Patent number 7,963,031
- Issue date Jun 21, 2011
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked package and method for manufacturing the package
- Patent number 7,928,557
- Issue date Apr 19, 2011
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same, and electronic c...
- Patent number 7,859,121
- Issue date Dec 28, 2010
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,768,140
- Issue date Aug 3, 2010
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,678,612
- Issue date Mar 16, 2010
- Shinko Electric Industries Co., Ltd.
- Tomoharu Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component built-in substrate and method of manufacturing...
- Patent number 7,678,681
- Issue date Mar 16, 2010
- Shinko Electric Industries, Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate to which semiconductor chi...
- Patent number 7,536,780
- Issue date May 26, 2009
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulated electronic part packaging structure
- Patent number 7,414,309
- Issue date Aug 19, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor parts
- Patent number 7,403,370
- Issue date Jul 22, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring board
- Patent number 7,375,022
- Issue date May 20, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor device and semiconductor device having the same, and capa...
- Patent number 7,358,591
- Issue date Apr 15, 2008
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electronic parts packaging structure
- Patent number 7,319,049
- Issue date Jan 15, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 7,284,307
- Issue date Oct 23, 2007
- Shinko Electric Industries Co., Ltd.
- Tomoo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic part packaging structure
- Patent number 7,229,856
- Issue date Jun 12, 2007
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250113438
- Publication date Apr 3, 2025
- Shinko Electric Industries Co., Ltd.
- Tomoyuki SHIMODAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PRINTED CIRCUIT BOARD
- Publication number 20230276575
- Publication date Aug 31, 2023
- Shinko Electric Industries Co., Ltd.
- Yukinori HATORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20220361342
- Publication date Nov 10, 2022
- Shinko Electric Industries Co., Ltd.
- Shota MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220028774
- Publication date Jan 27, 2022
- SHINKO ELECTRIC INDUSTRIES, CO., LTD.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW CELL
- Publication number 20190391069
- Publication date Dec 26, 2019
- Shinko Electric Industries Co., Ltd.
- Yuichiro Shimizu
- G01 - MEASURING TESTING
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20170103942
- Publication date Apr 13, 2017
- Shinko Electric Industries Co., Ltd.
- KIYOSHI OI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURIN...
- Publication number 20150357276
- Publication date Dec 10, 2015
- Shinko Electric Industries Co., LTD.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20150305153
- Publication date Oct 22, 2015
- Shinko Electric Industries Co., Ltd.
- Kei IMAFUJI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150228551
- Publication date Aug 13, 2015
- Shinko Electric Industries Co., Ltd.
- Kiyoshi OI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING WI...
- Publication number 20150223330
- Publication date Aug 6, 2015
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140170810
- Publication date Jun 19, 2014
- Shinko Electric Industries Co., LTD.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD
- Publication number 20120043005
- Publication date Feb 23, 2012
- Shinko Electric Industries Co., Ltd.
- Takatoyo YAMAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20110104886
- Publication date May 5, 2011
- Shinko Electric Industries Co., Ltd.
- Kiyoshi OI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF COM...
- Publication number 20100267208
- Publication date Oct 21, 2010
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD O...
- Publication number 20100244230
- Publication date Sep 30, 2010
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and method of manufacturing the same, and electronic c...
- Publication number 20100192371
- Publication date Aug 5, 2010
- Shinko Electric Industries Co., Ltd.
- Masahiro Sunohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20090258460
- Publication date Oct 15, 2009
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE SUBSTRATE INCLUDING OPTICAL TRANMISSION MECHANISM AND METHOD...
- Publication number 20090245724
- Publication date Oct 1, 2009
- Shinko Electric Industries Co., Ltd.
- Naoyuki KOIZUMI
- G02 - OPTICS
Information Patent Application
PACKAGE FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090151995
- Publication date Jun 18, 2009
- Shinko Electric Industries Co., Ltd.
- Naoyuki Koizumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND ELECTRONIC COMPONENT DEVICE
- Publication number 20090141464
- Publication date Jun 4, 2009
- Shinko Electric Industries Co., Ltd.
- Yuichi TAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...
- Publication number 20090121334
- Publication date May 14, 2009
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF COM...
- Publication number 20090121341
- Publication date May 14, 2009
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCT...
- Publication number 20080303153
- Publication date Dec 11, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080251944
- Publication date Oct 16, 2008
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE AND METHOD FOR MANUFACTURING THE PACKAGE
- Publication number 20080142944
- Publication date Jun 19, 2008
- Kiyoshi Oi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20080076249
- Publication date Mar 27, 2008
- Shinko Electric Industries Co., Ltd.
- Tomoharu Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component built-in substrate and method of manufacturing...
- Publication number 20070262452
- Publication date Nov 15, 2007
- SHINKO ELECTRIC INDUSTRIES CO., LTD.,
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of wiring board and manufacturing method of se...
- Publication number 20070111387
- Publication date May 17, 2007
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic parts and method of manufacturing electronic parts packa...
- Publication number 20070052086
- Publication date Mar 8, 2007
- Shinko Electric Industries Co., Ltd.
- Kiyoshi Oi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR PARTS
- Publication number 20060197184
- Publication date Sep 7, 2006
- Shinko Electric Industries Co., Ltd.
- Kiyoshi OI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Embedded printed circuit board

Semiconductor device

Composite wiring substrate and semiconductor device

Wiring substrate and semiconductor device

Wiring substrate, semiconductor device, and method for manufacturin...

Wiring substrate, semiconductor device, method of manufacturing wir...

Semiconductor device and method of manufacturing the same

Wiring substrate and semiconductor device

Method of manufacturing semiconductor device

Electronic packaging apparatus and electronic packaging method

Semiconductor device having electronic component in through part, e...

Wiring board and electronic component device

Manufacturing method of semiconductor device having underfill resin...

Module substrate including optical transmission mechanism and metho...

Manufacturing method of semiconductor package

Package for semiconductor device and method of manufacturing the same

Stacked package and method for manufacturing the package

Wiring board and method of manufacturing the same, and electronic c...

Semiconductor device

Method of manufacturing semiconductor device

Electronic component built-in substrate and method of manufacturing...

Method of manufacturing wiring substrate to which semiconductor chi...

Encapsulated electronic part packaging structure

Capacitor parts

Method of manufacturing wiring board

Capacitor device and semiconductor device having the same, and capa...

Method of manufacturing an electronic parts packaging structure

Method for manufacturing wiring board

Method of manufacturing electronic part packaging structure

Patents Applicationslast 30 patents

WIRING BOARD AND SEMICONDUCTOR DEVICE

EMBEDDED PRINTED CIRCUIT BOARD

COMPOSITE WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

FLOW CELL

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURIN...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING WI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

COMPONENT FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF COM...

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD O...

Wiring board and method of manufacturing the same, and electronic c...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

MODULE SUBSTRATE INCLUDING OPTICAL TRANMISSION MECHANISM AND METHOD...

PACKAGE FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND ELECTRONIC COMPONENT DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...

COMPONENT FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF COM...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCT...

SEMICONDUCTOR DEVICE

STACKED PACKAGE AND METHOD FOR MANUFACTURING THE PACKAGE

Method of manufacturing semiconductor device

Electronic component built-in substrate and method of manufacturing...

Manufacturing method of wiring board and manufacturing method of se...

Electronic parts and method of manufacturing electronic parts packa...

CAPACITOR PARTS