Kiyoshi Ozawa

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacture method for semiconductor device having improved copper...
- Patent number 8,383,509
- Issue date Feb 26, 2013
- Fujitsu Semiconductor Limited
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,956,462
- Issue date Jun 7, 2011
- Fujitsu Limited
- Takashi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with tensile strain and compressive strain
- Patent number 7,834,414
- Issue date Nov 16, 2010
- Fujitsu Limited
- Takashi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposure method for upper layer of hole of semiconductor device
- Patent number 7,678,693
- Issue date Mar 16, 2010
- Fujitsu Microelectronics Limited
- Fumitoshi Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor device having improved copper...
- Patent number 7,611,984
- Issue date Nov 3, 2009
- Fujitsu Microelectronics Limited
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method for making a reticle
- Patent number 7,226,866
- Issue date Jun 5, 2007
- Fujitsu Limited
- Hisatsugu Shirai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Organic electro luminescence display and its manufacture method
- Patent number 7,095,172
- Issue date Aug 22, 2006
- Fujitsu Limited
- Yoshiaki Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE HAVING IMPROVED COPPER...
- Publication number 20110151662
- Publication date Jun 23, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE HAVING IMPROVED COPPER...
- Publication number 20100007023
- Publication date Jan 14, 2010
- Fujitsu Microelectronics Limited
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20080237725
- Publication date Oct 2, 2008
- Fujitsu Limited
- Takashi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20080169542
- Publication date Jul 17, 2008
- Fujitsu Limited
- Takashi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Exposure method for upper layer of hole of semiconductor device
- Publication number 20080032437
- Publication date Feb 7, 2008
- FUJITSU LIMITED
- Fumitoshi Sugimoto
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Manufacture method for semiconductor device having improved copper...
- Publication number 20070020931
- Publication date Jan 25, 2007
- FUJITSU LIMITED
- Yumiko Koura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reticle manufacturing method
- Publication number 20050266318
- Publication date Dec 1, 2005
- FUJITSU LIMITED
- Hisatsugu Shirai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Organic electro luminescence display and its manufacture method
- Publication number 20050214577
- Publication date Sep 29, 2005
- FUJITSU LIMITED
- Yoshiaki Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS

Kiyoshi Ozawa

Person

Patents Grantslast 30 patents

Manufacture method for semiconductor device having improved copper...

Semiconductor device and manufacturing method thereof

Semiconductor device with tensile strain and compressive strain

Exposure method for upper layer of hole of semiconductor device

Manufacture method for semiconductor device having improved copper...

Etching method for making a reticle

Organic electro luminescence display and its manufacture method

Patents Applicationslast 30 patents

MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE HAVING IMPROVED COPPER...

MANUFACTURE METHOD FOR SEMICONDUCTOR DEVICE HAVING IMPROVED COPPER...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Exposure method for upper layer of hole of semiconductor device

Manufacture method for semiconductor device having improved copper...

Reticle manufacturing method

Organic electro luminescence display and its manufacture method