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Kiyotaka Kizaki
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Ota-Ku, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Adhesive film bonding method
Patent number
7,897,000
Issue date
Mar 1, 2011
Disco Corporation
Kiyotaka Kizaki
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Semiconductor wafer assembly and method of processing semiconductor...
Patent number
7,804,156
Issue date
Sep 28, 2010
Disco Corporation
Kiyotaka Kizaki
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
TAPE AFFIXING SYSTEM
Publication number
20240124258
Publication date
Apr 18, 2024
Tokyo Seimitsu Co., Ltd.
Kiyotaka KIZAKI
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
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Patent Application
TAPE AFFIXING APPARATUS
Publication number
20240087922
Publication date
Mar 14, 2024
Tokyo Seimitsu Co., Ltd.
Kiyotaka KIZAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TAPE AFFIXING APPARATUS AND TAPE MAGAZINE
Publication number
20230402301
Publication date
Dec 14, 2023
Tokyo Seimitsu Co., Ltd.
Kiyotaka KIZAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER ASSEMBLY AND METHOD OF PROCESSING SEMICONDUCTOR...
Publication number
20080296733
Publication date
Dec 4, 2008
Disco Corporation
Kiyotaka Kizaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Adhesive film bonding method
Publication number
20080257474
Publication date
Oct 23, 2008
DISCO CORPORATION
Kiyotaka Kizaki
H01 - BASIC ELECTRIC ELEMENTS