Kiyotaka Miwa

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Connection pad configuration of semiconductor device
- Patent number 10,991,668
- Issue date Apr 27, 2021
- Synaptics Incorporated
- Tsuyoshi Koga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a shallow trench isolation structure in a semico...
- Patent number 6,429,136
- Issue date Aug 6, 2002
- NEC Corporation
- Kiyotaka Miwa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20020142549
- Publication date Oct 3, 2002
- NEC Corporation
- Kiyotaka Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a shallow trench isolation structure in a semico...
- Publication number 20010009809
- Publication date Jul 26, 2001
- NEC Corporation
- Kiyotaka Miwa
- H01 - BASIC ELECTRIC ELEMENTS