Kiyotaka Nakaya

Person

Naka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing high-purity electrolytic copper
- Patent number 11,753,733
- Issue date Sep 12, 2023
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Anti-corrosion terminal material, anti-corrosion terminal and elect...
- Patent number 11,661,667
- Issue date May 30, 2023
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-plated copper terminal material and method of manufacturing the...
- Patent number 11,572,633
- Issue date Feb 7, 2023
- Mitsubishi Materials Corporation
- Fuyumi Mawatari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Terminal material with silver coating film and terminal with silver...
- Patent number 11,530,490
- Issue date Dec 20, 2022
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High-purity electrolytic copper
- Patent number 11,453,953
- Issue date Sep 27, 2022
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Tin or tin alloy plating solution
- Patent number 11,268,203
- Issue date Mar 8, 2022
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-plated copper terminal material, terminal, and electric-wire te...
- Patent number 11,264,750
- Issue date Mar 1, 2022
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Terminal material for connectors, terminal, and electric wire termi...
- Patent number 11,211,729
- Issue date Dec 28, 2021
- Mitsubishi Materials Corporation
- Kenji Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating liquid
- Patent number 11,174,565
- Issue date Nov 16, 2021
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin or tin alloy plating solution
- Patent number 11,162,182
- Issue date Nov 2, 2021
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-plated copper terminal material, terminal, and wire terminal pa...
- Patent number 11,088,472
- Issue date Aug 10, 2021
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Terminal material for connectors and method for producing same
- Patent number 10,923,245
- Issue date Feb 16, 2021
- Mitsubishi Materials Corporation
- Yuki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion-resistant terminal material, corrosion-resistant terminal...
- Patent number 10,910,130
- Issue date Feb 2, 2021
- Mitsubishi Materials Corporation
- Kenji Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin-plated copper terminal material, terminal and electric wire ter...
- Patent number 10,858,750
- Issue date Dec 8, 2020
- Mitsubishi Materials Corporation
- Kenji Kubota
- B32 - LAYERED PRODUCTS
Information Patent Grant
Tinned copper terminal material, terminal, and electrical wire end...
- Patent number 10,801,115
- Issue date Oct 13, 2020
- Mitsubishi Materials Corporation
- Kenji Kubota
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Additive for high-purity copper electrolytic refining and method of...
- Patent number 10,793,956
- Issue date Oct 6, 2020
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating solution using ammonium salt
- Patent number 10,450,665
- Issue date Oct 22, 2019
- Mitsubishi Materials Corporation
- Mami Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive for high-purity copper electrolytic refining, method of pr...
- Patent number 10,428,434
- Issue date Oct 1, 2019
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Additive for high-purity copper electrolytic refining and method of...
- Patent number 10,407,785
- Issue date Sep 10, 2019
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Additive for high-purity copper electrolytic refining and method of...
- Patent number 10,358,730
- Issue date Jul 23, 2019
- Mitsubishi Materials Corporation
- Yoshie Tarutani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Plating solution using sulfonium salt
- Patent number 10,329,680
- Issue date Jun 25, 2019
- Mitsubishi Materials Corporation
- Kiyotaka Nakaya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing tin-plated copper terminal material
- Patent number 10,301,737
- Issue date May 28, 2019
- Mitsubishi Materials Corporation
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating solution using phosphonium salt
- Patent number 10,174,434
- Issue date Jan 8, 2019
- Mitsubishi Materials Corporation
- Kiyotaka Nakaya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin-plated copper-alloy terminal material
- Patent number 10,047,448
- Issue date Aug 14, 2018
- Mitsubishi Materials Corporation
- Naoki Kato
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High-purity electrolytic copper and electrolytic refining method th...
- Patent number 9,783,904
- Issue date Oct 10, 2017
- Mitsubishi Materials Corporation
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING PASTE, BONDING LAYER, BONDED BODY, AND METHOD FOR PRODUCING...
- Publication number 20240321806
- Publication date Sep 26, 2024
- MITSUBISHI MATERIALS CORPORATION
- Koutarou Iwata
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PARTICLES AND METHOD FOR PRODUCING SAME
- Publication number 20240165699
- Publication date May 23, 2024
- MITSUBISHI MATERIALS CORPORATION
- Tomohiko Yamaguchi
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING SHEET
- Publication number 20230070283
- Publication date Mar 9, 2023
- MITSUBISHI MATERIALS CORPORATION
- Kotaro Masuyama
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD OF PRODUCING COPPER OXIDE POWDER, AND COPPER OXIDE POWDER
- Publication number 20230027568
- Publication date Jan 26, 2023
- MITSUBISHI MATERIALS CORPORATION
- Kyoka Susuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANTI-CORROSION TERMINAL MATERIAL, TERMINAL, AND ELECTRICAL WIRE END...
- Publication number 20220085526
- Publication date Mar 17, 2022
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR TERMINAL MATERIAL AND TERMINAL FOR CONNECTOR
- Publication number 20220069498
- Publication date Mar 3, 2022
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LAYER-INCLUDING CARBONACEOUS MEMBER AND HEAT CONDUCTION PLATE
- Publication number 20210352828
- Publication date Nov 11, 2021
- MITSUBISHI MATERIALS CORPORATION
- Koichi Kita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANTI-CORROSION TERMINAL MATERIAL, ANTI-CORROSION TERMINAL AND ELECT...
- Publication number 20210184380
- Publication date Jun 17, 2021
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TERMINAL MATERIAL WITH SILVER COATING FILM AND TERMINAL WITH SILVER...
- Publication number 20210158990
- Publication date May 27, 2021
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER TERMINAL MATERIAL AND METHOD OF MANUFACTURING THE...
- Publication number 20210108325
- Publication date Apr 15, 2021
- MITSUBISHI MATERIALS CORPORATION
- Fuyumi Mawatari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN-ALLOY PLATING LIQUID, BUMP FORMING METHOD, AND CIRCUIT B...
- Publication number 20210040636
- Publication date Feb 11, 2021
- MITSUBISHI MATERIALS CORPORATION
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN ALLOY PLATING SOLUTION
- Publication number 20200378025
- Publication date Dec 3, 2020
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING LIQUID
- Publication number 20200378023
- Publication date Dec 3, 2020
- MITSUBISHI MATERIALS CORPORATION
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN OR TIN ALLOY PLATING SOLUTION
- Publication number 20200378024
- Publication date Dec 3, 2020
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND WIRE TERMINAL PA...
- Publication number 20200259274
- Publication date Aug 13, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRIC-WIRE TE...
- Publication number 20200203868
- Publication date Jun 25, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING HIGH-PURITY ELECTROLYTIC COPPER
- Publication number 20200181788
- Publication date Jun 11, 2020
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL AND ELECTRIC WIRE TER...
- Publication number 20200173049
- Publication date Jun 4, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH-PURITY ELECTROLYTIC COPPER
- Publication number 20200173048
- Publication date Jun 4, 2020
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CORROSION-RESISTANT TERMINAL MATERIAL, CORROSION-RESISTANT TERMINAL...
- Publication number 20200005963
- Publication date Jan 2, 2020
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TERMINAL MATERIAL FOR CONNECTORS, TERMINAL, AND ELECTRIC WIRE TERMI...
- Publication number 20190386415
- Publication date Dec 19, 2019
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TERMINAL MATERIAL FOR CONNECTORS AND METHOD FOR PRODUCING SAME
- Publication number 20190362865
- Publication date Nov 28, 2019
- Mitsubishi Shindoh Co., Ltd
- Yuki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TINNED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRICAL WIRE END...
- Publication number 20190161866
- Publication date May 30, 2019
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING TIN-PLATED COPPER TERMINAL MATERIAL
- Publication number 20180347062
- Publication date Dec 6, 2018
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING SOLUTION USING AMMONIUM SALT
- Publication number 20180057953
- Publication date Mar 1, 2018
- MITSUBISHI MATERIALS CORPORATION
- Mami Watanabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING SOLUTION USING SULFONIUM SALT
- Publication number 20180051384
- Publication date Feb 22, 2018
- MITSUBISHI MATERIALS CORPORATION
- Kiyotaka Nakaya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING SOLUTION USING PHOSPHONIUM SALT
- Publication number 20180051383
- Publication date Feb 22, 2018
- MITSUBISHI MATERIALS CORPORATION
- Kiyotaka Nakaya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TIN-PLATED COPPER-ALLOY TERMINAL MATERIAL AND PRODUCING METHOD OF T...
- Publication number 20170298527
- Publication date Oct 19, 2017
- Naoki Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...
- Publication number 20170283966
- Publication date Oct 5, 2017
- MITSUBISHI MATERIALS CORPORATION
- Yoshie Tarutani
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...
- Publication number 20170283967
- Publication date Oct 5, 2017
- MITSUBISHI MATERIALS CORPORATION
- Kenji Kubota
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Kiyotaka Nakaya

Person

Patents Grantslast 30 patents

Method for producing high-purity electrolytic copper

Anti-corrosion terminal material, anti-corrosion terminal and elect...

Tin-plated copper terminal material and method of manufacturing the...

Terminal material with silver coating film and terminal with silver...

High-purity electrolytic copper

Tin or tin alloy plating solution

Tin-plated copper terminal material, terminal, and electric-wire te...

Terminal material for connectors, terminal, and electric wire termi...

Plating liquid

Tin or tin alloy plating solution

Tin-plated copper terminal material, terminal, and wire terminal pa...

Terminal material for connectors and method for producing same

Corrosion-resistant terminal material, corrosion-resistant terminal...

Tin-plated copper terminal material, terminal and electric wire ter...

Tinned copper terminal material, terminal, and electrical wire end...

Additive for high-purity copper electrolytic refining and method of...

Plating solution using ammonium salt

Additive for high-purity copper electrolytic refining, method of pr...

Additive for high-purity copper electrolytic refining and method of...

Additive for high-purity copper electrolytic refining and method of...

Plating solution using sulfonium salt

Method of manufacturing tin-plated copper terminal material

Plating solution using phosphonium salt

Tin-plated copper-alloy terminal material

High-purity electrolytic copper and electrolytic refining method th...

Patents Applicationslast 30 patents

BONDING PASTE, BONDING LAYER, BONDED BODY, AND METHOD FOR PRODUCING...

COPPER PARTICLES AND METHOD FOR PRODUCING SAME

BONDING SHEET

METHOD OF PRODUCING COPPER OXIDE POWDER, AND COPPER OXIDE POWDER

ANTI-CORROSION TERMINAL MATERIAL, TERMINAL, AND ELECTRICAL WIRE END...

CONNECTOR TERMINAL MATERIAL AND TERMINAL FOR CONNECTOR

METAL LAYER-INCLUDING CARBONACEOUS MEMBER AND HEAT CONDUCTION PLATE

ANTI-CORROSION TERMINAL MATERIAL, ANTI-CORROSION TERMINAL AND ELECT...

TERMINAL MATERIAL WITH SILVER COATING FILM AND TERMINAL WITH SILVER...

TIN-PLATED COPPER TERMINAL MATERIAL AND METHOD OF MANUFACTURING THE...

TIN OR TIN-ALLOY PLATING LIQUID, BUMP FORMING METHOD, AND CIRCUIT B...

TIN OR TIN ALLOY PLATING SOLUTION

PLATING LIQUID

TIN OR TIN ALLOY PLATING SOLUTION

TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND WIRE TERMINAL PA...

TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRIC-WIRE TE...

METHOD FOR PRODUCING HIGH-PURITY ELECTROLYTIC COPPER

TIN-PLATED COPPER TERMINAL MATERIAL, TERMINAL AND ELECTRIC WIRE TER...

HIGH-PURITY ELECTROLYTIC COPPER

CORROSION-RESISTANT TERMINAL MATERIAL, CORROSION-RESISTANT TERMINAL...

TERMINAL MATERIAL FOR CONNECTORS, TERMINAL, AND ELECTRIC WIRE TERMI...

TERMINAL MATERIAL FOR CONNECTORS AND METHOD FOR PRODUCING SAME

TINNED COPPER TERMINAL MATERIAL, TERMINAL, AND ELECTRICAL WIRE END...

METHOD OF MANUFACTURING TIN-PLATED COPPER TERMINAL MATERIAL

PLATING SOLUTION USING AMMONIUM SALT

PLATING SOLUTION USING SULFONIUM SALT

PLATING SOLUTION USING PHOSPHONIUM SALT

TIN-PLATED COPPER-ALLOY TERMINAL MATERIAL AND PRODUCING METHOD OF T...

ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...

ADDITIVE FOR HIGH-PURITY COPPER ELECTROLYTIC REFINING AND METHOD OF...