Kiyotaka Seyama

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board manufacturing method
- Patent number 7,935,891
- Issue date May 3, 2011
- Fujitsu Limited
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board manufacturing method
- Patent number 7,377,030
- Issue date May 27, 2008
- Fujitsu Limited
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board unit for optical transmission and mounting method
- Patent number 6,959,125
- Issue date Oct 25, 2005
- Fujitsu Limited
- Takashi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip module having chips mounted on upper and under surfaces o...
- Patent number 6,693,362
- Issue date Feb 17, 2004
- Fujitsu Limited
- Kiyotaka Seyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming bumps using dummy wafer
- Patent number 6,057,168
- Issue date May 2, 2000
- Fujitsu Limited
- Kiyotaka Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink structure for cooling a substrate and an electronic appar...
- Patent number 5,894,882
- Issue date Apr 20, 1999
- Fujitsu Limited
- Shunichi Kikuchi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling device for mounting module
- Patent number 5,862,038
- Issue date Jan 19, 1999
- Fujitsu Limited
- Masahiro Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer thin-film wiring board
- Patent number 5,608,192
- Issue date Mar 4, 1997
- Fujitsu Limited
- Kiyokazu Moriizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module having a multi-layer circuit board with insulatin...
- Patent number 5,586,006
- Issue date Dec 17, 1996
- Fujitsu Limited
- Kiyotaka Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module having thermal contacts
- Patent number 5,432,675
- Issue date Jul 11, 1995
- Fujitsu Limited
- Haruo Sorimachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an engineering change to a printed wiring board
- Patent number 5,181,317
- Issue date Jan 26, 1993
- Fujitsu Limited
- Mikio Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bus bar for a circuit board
- Patent number 5,166,867
- Issue date Nov 24, 1992
- Fujitsu Limited
- Kiyotaka Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module sealing structure
- Patent number 4,949,219
- Issue date Aug 14, 1990
- Fujitsu Limited
- Kiyokazu Moriizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density printed wiring board
- Patent number 4,912,603
- Issue date Mar 27, 1990
- Fujitsu Limited
- Kiyotaka Seyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wiring board manufacturing method
- Publication number 20080142256
- Publication date Jun 19, 2008
- FUJITSU LIMITED
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board manufacturing method
- Publication number 20060112544
- Publication date Jun 1, 2006
- FUJITSU LIMITED
- Takashi Shuto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed board unit for optical transmission and mounting method
- Publication number 20030228084
- Publication date Dec 11, 2003
- FUJITSU LIMITED
- Takashi Kanda
- G02 - OPTICS
Information Patent Application
Multichip module having chips mounted on upper and under surfaces o...
- Publication number 20020149098
- Publication date Oct 17, 2002
- FUJITSU LIMITED
- Kiyotaka Seyama
- H01 - BASIC ELECTRIC ELEMENTS

Kiyotaka Seyama

Person

Patents Grantslast 30 patents

Wiring board manufacturing method

Wiring board manufacturing method

Printed board unit for optical transmission and mounting method

Multichip module having chips mounted on upper and under surfaces o...

Method for forming bumps using dummy wafer

Heat sink structure for cooling a substrate and an electronic appar...

Cooling device for mounting module

Multilayer thin-film wiring board

Multi-chip module having a multi-layer circuit board with insulatin...

Multi-chip module having thermal contacts

Method of making an engineering change to a printed wiring board

Bus bar for a circuit board

Module sealing structure

High density printed wiring board

Patents Applicationslast 30 patents

Wiring board manufacturing method

Wiring board manufacturing method

Printed board unit for optical transmission and mounting method

Multichip module having chips mounted on upper and under surfaces o...