Kiyotaka Shimada

Follow

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Chip component mounted wiring board
- Patent number 8,331,101
- Issue date Dec 11, 2012
- Shinko Electronic Industries Co., Ltd.
- Toshiaki Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate with lead pin and lead pin
- Patent number 8,153,900
- Issue date Apr 10, 2012
- Shinko Electric Industries Co., Ltd.
- Hirokazu Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing multilayer circuit board for semiconductor device
- Patent number 6,988,312
- Issue date Jan 24, 2006
- Shinko Electric Industries Co., Ltd.
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer sheet and process for making a circuit substrate
- Patent number 4,969,257
- Issue date Nov 13, 1990
- Shinko Electric Industries, Co., Ltd.
- Takeshi Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming a circuit substrate
- Patent number 4,867,839
- Issue date Sep 19, 1989
- Shinko Electric Industries Co., Ltd.
- Takeshi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
CHIP COMPONENT MOUNTED WIRING BOARD
- Publication number 20100214751
- Publication date Aug 26, 2010
- Shinko Electric Industries Co., Ltd.
- Toshiaki AOKI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING SUBSTRATE WITH LEAD PIN AND LEAD PIN
- Publication number 20090056992
- Publication date Mar 5, 2009
- Shinko Electric Industries Co., Ltd.
- Hirokazu Takeuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING SUBSTRATE WITH LEAD PIN AND LEAD PIN
- Publication number 20090038823
- Publication date Feb 12, 2009
- Shinko Electric Industries Co., Ltd.
- Yoshinori Furihata
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for manufacturing multilayer circuit board for semiconductor...
- Publication number 20040074088
- Publication date Apr 22, 2004
- Jyunichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR