Klan Hock Lim

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for semiconductor package
- Patent number 9,136,215
- Issue date Sep 15, 2015
- Advanpack Solutions Pte. Ltd.
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package and Trace Substrate with Enhanced Routing Des...
- Publication number 20110210442
- Publication date Sep 1, 2011
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS