Klaus-Gunter Oppermann

Person

Holzkirchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Bulk acoustic wave resonator
- Patent number 10,284,168
- Issue date May 7, 2019
- Avago Technologies International Sales Pte. Limited
- Brice Ivira
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Packaged device including cavity package with elastic layer within...
- Patent number 9,680,445
- Issue date Jun 13, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Andrew Thomas Barfknecht
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for housing an electronic component in a device package and...
- Patent number 9,312,212
- Issue date Apr 12, 2016
- Infineon Technologies AG
- Klaus-Guenter Oppermann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electrical device with protruding contact elements and overhang reg...
- Patent number 8,884,437
- Issue date Nov 11, 2014
- Infineon Technologies AG
- Klaus-Guenter Oppermann
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device layer structure and method of fabrication
- Patent number 8,618,621
- Issue date Dec 31, 2013
- Infineon Technologies AG
- Klaus-Guenter Oppermann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for housing an electronic component in a device package and...
- Patent number 8,501,534
- Issue date Aug 6, 2013
- Infineon Technologies AG
- Klaus-Guenter Oppermann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electrical device with protruding contact elements and overhang reg...
- Patent number 8,319,344
- Issue date Nov 27, 2012
- Infineon Technologies AG
- Klaus-Guenter Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a coupled resonator device
- Patent number 8,209,826
- Issue date Jul 3, 2012
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Martin Handtmann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Device and method for reducing a voltage dependent capacitive coupling
- Patent number 8,188,548
- Issue date May 29, 2012
- Infineon Technologies AG
- Klaus-Guenter Oppermann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for developing a photoresist
- Patent number 8,148,055
- Issue date Apr 3, 2012
- Infineon Technologies AG
- Klaus-Guenter Oppermann
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Apparatus comprising a device and method for producing it
- Patent number 7,851,333
- Issue date Dec 14, 2010
- Infineon Technologies AG
- Klaus-Guenter Oppermann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Solder contacts and methods of forming same
- Patent number 7,745,321
- Issue date Jun 29, 2010
- Qimonda AG
- Alfred Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for housing a micromechanical structure
- Patent number 7,692,317
- Issue date Apr 6, 2010
- Infineon Technologies AG
- Martin Franosch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a polymer structure on a substrate surface
- Patent number 7,682,777
- Issue date Mar 23, 2010
- Infineon Technologies AG
- Martin Franosch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus for housing a micromechanical structure and method for pr...
- Patent number 7,300,823
- Issue date Nov 27, 2007
- Infineon Technologies AG
- Martin Franosch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a cover, method for producing a packaged device
- Patent number 7,288,435
- Issue date Oct 30, 2007
- Infineon Technologies AG
- Robert Aigner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for producing a protective cover for a device
- Patent number 7,234,237
- Issue date Jun 26, 2007
- Infineon Technologies AG
- Martin Franosch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for generating a protective cover for a device
- Patent number 6,955,950
- Issue date Oct 18, 2005
- Infineon Technologies AG
- Robert Aigner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a protective cover for a device
- Patent number 6,939,734
- Issue date Sep 6, 2005
- Infineon Technologies AG
- Martin Franosch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor component for high reverse voltages in conjunction wi...
- Patent number 6,762,455
- Issue date Jul 13, 2004
- Infineon Technologies AG
- Klaus-Günter Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a filled recess in a material layer, and an in...
- Patent number 6,724,058
- Issue date Apr 20, 2004
- Infineon Technologies AG
- Robert Aigner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Micromechanical component and process for its fabrication
- Patent number 6,556,418
- Issue date Apr 29, 2003
- Infineon Technologies AG
- Robert Aigner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Production method for micromechanical components
- Patent number 6,406,933
- Issue date Jun 18, 2002
- Infineon Technologies AG
- Robert Aigner
- G01 - MEASURING TESTING
Information Patent Grant
Micromechanical component protected from environmental influences
- Patent number 6,401,544
- Issue date Jun 11, 2002
- Infineon Technologies AG
- Robert Aigner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical structure, sensor and method for manufacturing the...
- Patent number 6,373,115
- Issue date Apr 16, 2002
- Siemens Aktiengesellschaft
- Stefan Kolb
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating integrated sensors
- Patent number 6,346,429
- Issue date Feb 12, 2002
- Infineon Technologies AG
- Robert Aigner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Photodiode having reduced series resistance, and method for fabrica...
- Patent number 5,994,751
- Issue date Nov 30, 1999
- Siemens Aktiengesellschaft
- Klaus-Gunter Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit arrangement having at least one IGBT
- Patent number 5,760,424
- Issue date Jun 2, 1998
- Siemens Aktiengesellschaft
- Klaus-Guenter Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with interconnect formed along walls o...
- Patent number 5,747,867
- Issue date May 5, 1998
- Siemens Aktiengesellschaft
- Klaus-Guenter Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure having at least one bipolar power component and m...
- Patent number 5,519,241
- Issue date May 21, 1996
- Siemens Aktiengesellschaft
- Klaus-Guenter Oppermann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BULK ACOUSTIC WAVE RESONATOR
- Publication number 20190190483
- Publication date Jun 20, 2019
- Avago Technologies International Sales Pte. Limited
- Brice Ivira
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC WAVE RESONATOR
- Publication number 20180123558
- Publication date May 3, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Brice Ivira
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGED DEVICE INCLUDING CAVITY PACKAGE WITH ELASTIC LAYER WITHIN...
- Publication number 20160126443
- Publication date May 5, 2016
- Avago Technologies General IP (Singapore) PTE. LTD.
- Andrew Thomas Barfknecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Housing an Electronic Component in a Device Package and...
- Publication number 20130292855
- Publication date Nov 7, 2013
- Klaus-Guenter Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH CONTACT ELEMENTS
- Publication number 20130082392
- Publication date Apr 4, 2013
- INFINEON TECHNOLOGIES AG
- Klaus-Guenter Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS COMPRISING A DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20110042764
- Publication date Feb 24, 2011
- Klaus-Guenter Oppermann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for Housing an Electronic Component in a Device Package and...
- Publication number 20100013032
- Publication date Jan 21, 2010
- Klaus-Guenter Oppermann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DEVICE WITH CONTACT ELEMENTS
- Publication number 20100007016
- Publication date Jan 14, 2010
- INFINEON TECHNOLOGIES AG
- Klaus-Guenter Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coupled Resonator Device and Method for Manufacturing a Coupled Res...
- Publication number 20090265903
- Publication date Oct 29, 2009
- Martin Handtmann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SOLDER CONTACTS AND METHODS OF FORMING SAME
- Publication number 20090179333
- Publication date Jul 16, 2009
- Alfred Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus comprising a device and method for producing it
- Publication number 20080224297
- Publication date Sep 18, 2008
- Infineon Technologies AG
- Klaus-Guenter Oppermann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Device and method for reducing a voltage dependent capacitive coupling
- Publication number 20080197423
- Publication date Aug 21, 2008
- Infineon Technologies AG
- Klaus-Guenter Oppermann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
APPARATUS FOR HOUSING A MICROMECHANICAL STRUCTURE
- Publication number 20080017974
- Publication date Jan 24, 2008
- INFINEON TECHNOLOGIES AG
- Martin Franosch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Developing a Photoresist
- Publication number 20080020330
- Publication date Jan 24, 2008
- Klaus-Guenter Oppermann
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for producing a polymer structure on a substrate surface
- Publication number 20060240643
- Publication date Oct 26, 2006
- Infineon Technologies AG
- Martin Franosch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Concept for the wet-chemical removal of a sacrificial material in a...
- Publication number 20060191868
- Publication date Aug 31, 2006
- Infineon Technologies AG
- Martin Franosch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Lift-off method
- Publication number 20060183325
- Publication date Aug 17, 2006
- Infineon Technologies AG
- Martin Franosch
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Apparatus for housing a micromechanical structure and method for pr...
- Publication number 20050146022
- Publication date Jul 7, 2005
- Infineon Technologies AG
- Martin Franosch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for producing a protective cover for a device
- Publication number 20050148205
- Publication date Jul 7, 2005
- Infineon Technologies AG
- Martin Franosch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for producing a cover, method for producing a packaged device
- Publication number 20050079686
- Publication date Apr 14, 2005
- Infineon Technologies AG
- Robert Aigner
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for generating a protective cover for a device
- Publication number 20050048757
- Publication date Mar 3, 2005
- Infineon Technologies AG
- Robert Aigner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for producing a protective cover for a device
- Publication number 20050009316
- Publication date Jan 13, 2005
- Infineon Technologies AG
- Martin Franosch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor component for high reverse voltages in conjunction wi...
- Publication number 20020117715
- Publication date Aug 29, 2002
- Klaus-Gunter Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical component protected from environmental influences
- Publication number 20010054315
- Publication date Dec 27, 2001
- Robert Aigner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Deformation gauge
- Publication number 20010048139
- Publication date Dec 6, 2001
- Robert Aigner
- G01 - MEASURING TESTING
Information Patent Application
Micromechanical component and process for its fabrication
- Publication number 20010021538
- Publication date Sep 13, 2001
- Robert Aigner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Configuration with a plurality of sensor groups and method of deter...
- Publication number 20010013773
- Publication date Aug 16, 2001
- Robert Aigner
- G01 - MEASURING TESTING
Information Patent Application
Method for producing a filled recess in a material layer, and an in...
- Publication number 20010005032
- Publication date Jun 28, 2001
- Robert Aigner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Klaus-Gunter Oppermann

Person

Patents Grantslast 30 patents

Bulk acoustic wave resonator

Packaged device including cavity package with elastic layer within...

Method for housing an electronic component in a device package and...

Electrical device with protruding contact elements and overhang reg...

Semiconductor device layer structure and method of fabrication

Method for housing an electronic component in a device package and...

Electrical device with protruding contact elements and overhang reg...

Method for manufacturing a coupled resonator device

Device and method for reducing a voltage dependent capacitive coupling

Method for developing a photoresist

Apparatus comprising a device and method for producing it

Solder contacts and methods of forming same

Apparatus for housing a micromechanical structure

Method for producing a polymer structure on a substrate surface

Apparatus for housing a micromechanical structure and method for pr...

Method for producing a cover, method for producing a packaged device

Method for producing a protective cover for a device

Method for generating a protective cover for a device

Method for producing a protective cover for a device

Semiconductor component for high reverse voltages in conjunction wi...

Method for producing a filled recess in a material layer, and an in...

Micromechanical component and process for its fabrication

Production method for micromechanical components

Micromechanical component protected from environmental influences

Micromechanical structure, sensor and method for manufacturing the...

Method for fabricating integrated sensors

Photodiode having reduced series resistance, and method for fabrica...

Integrated circuit arrangement having at least one IGBT

Integrated circuit structure with interconnect formed along walls o...

Circuit structure having at least one bipolar power component and m...

Patents Applicationslast 30 patents

BULK ACOUSTIC WAVE RESONATOR

BULK ACOUSTIC WAVE RESONATOR

PACKAGED DEVICE INCLUDING CAVITY PACKAGE WITH ELASTIC LAYER WITHIN...

Method for Housing an Electronic Component in a Device Package and...

DEVICE WITH CONTACT ELEMENTS

APPARATUS COMPRISING A DEVICE AND METHOD FOR PRODUCING SAME

Method for Housing an Electronic Component in a Device Package and...

DEVICE WITH CONTACT ELEMENTS

Coupled Resonator Device and Method for Manufacturing a Coupled Res...

SOLDER CONTACTS AND METHODS OF FORMING SAME

Apparatus comprising a device and method for producing it

Device and method for reducing a voltage dependent capacitive coupling

APPARATUS FOR HOUSING A MICROMECHANICAL STRUCTURE

Method for Developing a Photoresist

Method for producing a polymer structure on a substrate surface

Concept for the wet-chemical removal of a sacrificial material in a...

Lift-off method

Apparatus for housing a micromechanical structure and method for pr...

Method for producing a protective cover for a device

Method for producing a cover, method for producing a packaged device

Method for generating a protective cover for a device

Method for producing a protective cover for a device

Semiconductor component for high reverse voltages in conjunction wi...

Micromechanical component protected from environmental influences

Deformation gauge

Micromechanical component and process for its fabrication

Configuration with a plurality of sensor groups and method of deter...

Method for producing a filled recess in a material layer, and an in...