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Klaus H. Pfeifer
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Kalispell, MT, US
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last 30 patents
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Patent Grant
Deplating contacts in an electrochemical plating apparatus
Patent number
8,500,968
Issue date
Aug 6, 2013
Applied Materials, Inc.
Daniel J. Woodruff
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
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Patent Application
DEPLATING CONTACTS IN AN ELECTROCHEMICAL PLATING APPARATUS
Publication number
20120037495
Publication date
Feb 16, 2012
Daniel J. Woodruff
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR