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Klaus Rottger
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Bachmehring, DE
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Patents Grants
last 30 patents
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Patent Grant
Process and device for polishing semiconductor wafers
Patent number
6,095,898
Issue date
Aug 1, 2000
Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
Heinrich Hennhofer
B24 - GRINDING POLISHING
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Patent Grant
Method and device for polishing semiconductor wafers
Patent number
5,980,361
Issue date
Nov 9, 1999
Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
Paul Muller
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
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Patent Application
Method and device for producing an adhesive-bonded connection betwe...
Publication number
20030034110
Publication date
Feb 20, 2003
WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
Thomas Hubel
B32 - LAYERED PRODUCTS