Klaus Telgenbüscher

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Hamburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive compound and method for encapsulating an electronic arrang...
- Patent number 9,230,829
- Issue date Jan 5, 2016
- TESA SE
- Klaus Telgenbüscher
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOUND AND METHOD FOR ENCAPSULATING AN ELECTRONIC ARRANG...
- Publication number 20130264724
- Publication date Oct 10, 2013
- tesa SE
- Klaus Telgenbüscher
- H01 - BASIC ELECTRIC ELEMENTS