Klaus WILKE

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Vibration-damped circuit arrangement, converter, and aircraft havin...
- Patent number 11,564,310
- Issue date Jan 24, 2023
- Rolls-Royce Deutschland Ltd & Co KG
- Rene Blank
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for mounting an electrical component in which a hood is used...
- Patent number 11,424,170
- Issue date Aug 23, 2022
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module having a power electronics device on a substrate board...
- Patent number 11,373,984
- Issue date Jun 28, 2022
- Siemens Aktiengesellschaft
- Jörg Strogies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and power module having a power electronic comp...
- Patent number 11,373,804
- Issue date Jun 28, 2022
- Siemens Aktiengesellschaft
- Wilhelm Meyrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder alloy for power devices and solder joint having a high curre...
- Patent number 11,331,759
- Issue date May 17, 2022
- Senju Metal Industry Co., Ltd.
- Hans-Jurgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering material based on Sn Ag and Cu
- Patent number 11,285,569
- Issue date Mar 29, 2022
- Henkel AG & Co. KGaA
- Hans-Jurgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component and method for producing same
- Patent number 11,289,425
- Issue date Mar 29, 2022
- Siemens Aktiengesellschaft
- Rene Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder preform for establishing a diffusion solder connection and m...
- Patent number 11,285,568
- Issue date Mar 29, 2022
- Siemens Aktiengesellschaft
- Jörg Strogies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronic circuit having a plurality of power modules
- Patent number 11,282,822
- Issue date Mar 22, 2022
- Siemens Aktiengesellschaft
- Wilhelm Meyrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical assembly
- Patent number 11,212,918
- Issue date Dec 28, 2021
- Siemens Aktiengesellschaft
- Rene Blank
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly with a component arranged between two circuit c...
- Patent number 10,420,220
- Issue date Sep 17, 2019
- Siemens Aktiengesellschaft
- Thomas Bigl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering material based on Sn Ag and Cu
- Patent number 10,376,994
- Issue date Aug 13, 2019
- Hans-Jürgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting an electrical component, wherein a hood is used...
- Patent number 10,008,394
- Issue date Jun 26, 2018
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the diffusion soldering of an electronic component to a...
- Patent number 10,004,147
- Issue date Jun 19, 2018
- Siemens Aktiengesellschaft
- Joerg Strogies
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Device Comprising a Component and a Coupled Cooling Body
- Publication number 20240038621
- Publication date Feb 1, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Jörg Strogies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joining and Insulating Power Electronic Semiconductor Components
- Publication number 20230215838
- Publication date Jul 6, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Bernd Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOLERANCE COMPENSATION ELEMENT FOR CIRCUIT CONFIGURATIONS
- Publication number 20230189450
- Publication date Jun 15, 2023
- Siemens Aktiengesellschaft
- Rene BLANK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semifinished Product for Populating with Components and, Method for...
- Publication number 20220336408
- Publication date Oct 20, 2022
- SIEMENS AKTIENGESELLSCHAFT
- Nora Jeske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Installing an Electronic Assembly
- Publication number 20220285311
- Publication date Sep 8, 2022
- SIEMENS AKTIENGESELLSCHAFT
- Matthias Heimann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING MATERIAL BASED ON SN AG AND CU
- Publication number 20220168851
- Publication date Jun 2, 2022
- Henkel AG & Co. KGaA
- Hans-Jurgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Carrier Having an Installation Place for Electronic Compone...
- Publication number 20210351151
- Publication date Nov 11, 2021
- SIEMENS AKTIENGESELLSCHAFT
- Robby Urbahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Electronic Circuit Having A Plurality Of Power Modules
- Publication number 20210242187
- Publication date Aug 5, 2021
- SIEMENS AKTIENGESELLSCHAFT
- Wilhelm Meyrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING ELECTRICAL COMPONENTS
- Publication number 20210176885
- Publication date Jun 10, 2021
- Siemens Aktiengesellschaft
- Dirk POEHLER
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
VIBRATION-DAMPED CIRCUIT ARRANGEMENT, CONVERTER, AND AIRCRAFT HAVIN...
- Publication number 20210161002
- Publication date May 27, 2021
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Rene Blank
- G11 - INFORMATION STORAGE
Information Patent Application
Power Module Having a Power Electronics Device on a Substrate Board...
- Publication number 20210151417
- Publication date May 20, 2021
- SIEMENS AKTIENGESELLSCHAFT
- Jörg Strogies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CREATION OF AN ELECTRICAL CONNECTION BETWEEN COMPONENTS AND A CONTA...
- Publication number 20210098974
- Publication date Apr 1, 2021
- Siemens Aktiengesellschaft
- Dirk POEHLER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Capacitor Structure and Power Module Having a Power Electronic Comp...
- Publication number 20210090798
- Publication date Mar 25, 2021
- SIEMENS AKTIENGESELLSCHAFT
- Wilhelm Meyrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ARRANGEMENT HAVING A SPACER ELEMENT, CONVERTER AND AIRCRAFT...
- Publication number 20210021179
- Publication date Jan 21, 2021
- Rene Blank
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
Solder Alloy for Power Devices and Solder Joint Having a High Curre...
- Publication number 20210008670
- Publication date Jan 14, 2021
- SENJU METAL INDUSTRY CO., LTD.
- Hans-Jurgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Assembly
- Publication number 20200170111
- Publication date May 28, 2020
- SIEMENS AKTIENGESELLSCHAFT
- Rene Blank
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Component and Method for Producing Same
- Publication number 20200161246
- Publication date May 21, 2020
- SIEMENS AKTIENGESELLSCHAFT
- Rene Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly With a Component Located Between Two Substrates...
- Publication number 20200152532
- Publication date May 14, 2020
- SIEMENS AKTIENGESELLSCHAFT
- Rene Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Preform for Establishing a Diffusion Solder Connection and M...
- Publication number 20200147731
- Publication date May 14, 2020
- SIEMENS AKTIENGESELLSCHAFT
- Jörg Strogies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Preform for Diffusion Soldering, Method for the Production t...
- Publication number 20200139490
- Publication date May 7, 2020
- SIEMENS AKTIENGESELLSCHAFT
- Jörg Strogies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOLERANCE COMPENSATION ELEMENT FOR CIRCUIT CONFIGURATIONS
- Publication number 20200122450
- Publication date Apr 23, 2020
- Siemens Aktiengesellschaft
- Rene BLANK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING MATERIAL BASED ON SN AG AND CU
- Publication number 20200023472
- Publication date Jan 23, 2020
- Henkel AG & Co. KGaA
- Hans-Jurgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Assembly With A Component Arranged Between Two Circuit C...
- Publication number 20190191566
- Publication date Jun 20, 2019
- SIEMENS AKTIENGESELLSCHAFT
- Thomas BIGL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Mounting An Electrical Component, Wherein A Hood Is Used...
- Publication number 20170117162
- Publication date Apr 27, 2017
- Siemens Aktiengesellschaft
- Nora BUSCHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Mounting An Electrical Component In Which A Hood Is Used...
- Publication number 20170033024
- Publication date Feb 2, 2017
- Siemens Aktiengesellschaft
- Nora Busche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diffusion Soldering Method Using The Formation Of A Diffusion Zone...
- Publication number 20160219720
- Publication date Jul 28, 2016
- Siemens Aktiengesellschaft
- Joerg Strogies
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy for Power Devices and Solder Joint Having a High Curre...
- Publication number 20140112710
- Publication date Apr 24, 2014
- SENJU METAL INDUSTRY CO., LTD.
- Hans-Jurgen Albrecht
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Soldering material based on sn ag and cu
- Publication number 20070036671
- Publication date Feb 15, 2007
- Hans-Jurgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Klaus WILKE

Person

Patents Grantslast 30 patents

Vibration-damped circuit arrangement, converter, and aircraft havin...

Method for mounting an electrical component in which a hood is used...

Power module having a power electronics device on a substrate board...

Capacitor structure and power module having a power electronic comp...

Solder alloy for power devices and solder joint having a high curre...

Soldering material based on Sn Ag and Cu

Semiconductor component and method for producing same

Solder preform for establishing a diffusion solder connection and m...

Power electronic circuit having a plurality of power modules

Electrical assembly

Electronic assembly with a component arranged between two circuit c...

Soldering material based on Sn Ag and Cu

Method for mounting an electrical component, wherein a hood is used...

Method for the diffusion soldering of an electronic component to a...

Patents Applicationslast 30 patents

Device Comprising a Component and a Coupled Cooling Body

Joining and Insulating Power Electronic Semiconductor Components

TOLERANCE COMPENSATION ELEMENT FOR CIRCUIT CONFIGURATIONS

Semifinished Product for Populating with Components and, Method for...

Installing an Electronic Assembly

SOLDERING MATERIAL BASED ON SN AG AND CU

Circuit Carrier Having an Installation Place for Electronic Compone...

Power Electronic Circuit Having A Plurality Of Power Modules

CONNECTING ELECTRICAL COMPONENTS

VIBRATION-DAMPED CIRCUIT ARRANGEMENT, CONVERTER, AND AIRCRAFT HAVIN...

Power Module Having a Power Electronics Device on a Substrate Board...

CREATION OF AN ELECTRICAL CONNECTION BETWEEN COMPONENTS AND A CONTA...

Capacitor Structure and Power Module Having a Power Electronic Comp...

CIRCUIT ARRANGEMENT HAVING A SPACER ELEMENT, CONVERTER AND AIRCRAFT...

Solder Alloy for Power Devices and Solder Joint Having a High Curre...

Electrical Assembly

Semiconductor Component and Method for Producing Same

Electronic Assembly With a Component Located Between Two Substrates...

Solder Preform for Establishing a Diffusion Solder Connection and M...

Solder Preform for Diffusion Soldering, Method for the Production t...

TOLERANCE COMPENSATION ELEMENT FOR CIRCUIT CONFIGURATIONS

SOLDERING MATERIAL BASED ON SN AG AND CU

Electronic Assembly With A Component Arranged Between Two Circuit C...

Method For Mounting An Electrical Component, Wherein A Hood Is Used...

Method For Mounting An Electrical Component In Which A Hood Is Used...

Diffusion Soldering Method Using The Formation Of A Diffusion Zone...

Solder Alloy for Power Devices and Solder Joint Having a High Curre...

Soldering material based on sn ag and cu