Klemens Ferstl

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Regensburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Multichip module for LOC mounting and method for producing the mult...
- Patent number 7,276,781
- Issue date Oct 2, 2007
- Infineon Technologies AG
- Klemens Ferstl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding conductors, in particular beam leads
- Patent number 6,430,809
- Issue date Aug 13, 2002
- Infineon Technologies AG
- Monika Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multichip module for LOC mounting and method for producing the mult...
- Publication number 20020079559
- Publication date Jun 27, 2002
- Klemens Ferstl
- H01 - BASIC ELECTRIC ELEMENTS