Knut Kahlisch

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate for an FBGA semiconductor component
- Patent number 7,518,220
- Issue date Apr 14, 2009
- Infineon Technologies AG
- Steffen Kroehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a package for semiconductor chips
- Patent number 7,326,593
- Issue date Feb 5, 2008
- Infineon Technologies AG
- Andreas Bischof
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support matrix with bonding channel for integrated semiconductors,...
- Patent number 6,979,887
- Issue date Dec 27, 2005
- Infineon Technologies AG
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe of a conductive material and component with a leadframe o...
- Patent number 6,946,721
- Issue date Sep 20, 2005
- Infineon Technologies AG
- Stephan Dobritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a semiconductor chip
- Patent number 6,724,076
- Issue date Apr 20, 2004
- Infineon Technologies AG
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support matrix for integrated semiconductors, and method for produc...
- Patent number 6,605,864
- Issue date Aug 12, 2003
- Infineon Technologies AG
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit and Memory Module
- Publication number 20090194890
- Publication date Aug 6, 2009
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit, Semiconductor Module and Method for Manufacturi...
- Publication number 20090189292
- Publication date Jul 30, 2009
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing semiconductor components
- Publication number 20070216038
- Publication date Sep 20, 2007
- Soo Gil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for an electronic component assembly and corre...
- Publication number 20060270109
- Publication date Nov 30, 2006
- Stephan Blaszczak
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and casting mold for producing a protective layer on integra...
- Publication number 20060255504
- Publication date Nov 16, 2006
- Steffen Kroehnert
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Substrate for producing a soldering connection to a second substrate
- Publication number 20060237855
- Publication date Oct 26, 2006
- Steffen Kroehnert
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods of producing a package for semiconductor chips
- Publication number 20060211166
- Publication date Sep 21, 2006
- Andreas Bischof
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for an FBGA semiconductor component
- Publication number 20060180929
- Publication date Aug 17, 2006
- Steffen Kroehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing an FBGA component and substrate for carrying o...
- Publication number 20060180921
- Publication date Aug 17, 2006
- Steffen Kroehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Supporting structure for a chip and method for producing the same
- Publication number 20040159928
- Publication date Aug 19, 2004
- Infineon Technologies AG
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of marking substandard parts
- Publication number 20040022959
- Publication date Feb 5, 2004
- Knut Kahlisch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Leadframe and component with a leadframe
- Publication number 20030098498
- Publication date May 29, 2003
- Stephan Dobritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support matrix for integrated semiconductors, and method for produc...
- Publication number 20020006688
- Publication date Jan 17, 2002
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support matrix with bonding channel for integrated semiconductors,...
- Publication number 20020003295
- Publication date Jan 10, 2002
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS

Knut Kahlisch

Person

Patents Grantslast 30 patents

Substrate for an FBGA semiconductor component

Method of producing a package for semiconductor chips

Support matrix with bonding channel for integrated semiconductors,...

Leadframe of a conductive material and component with a leadframe o...

Package for a semiconductor chip

Support matrix for integrated semiconductors, and method for produc...

Patents Applicationslast 30 patents

Integrated Circuit and Memory Module

Integrated Circuit, Semiconductor Module and Method for Manufacturi...

Method for producing semiconductor components

Manufacturing method for an electronic component assembly and corre...

Method and casting mold for producing a protective layer on integra...

Substrate for producing a soldering connection to a second substrate

Methods of producing a package for semiconductor chips

Substrate for an FBGA semiconductor component

Method for producing an FBGA component and substrate for carrying o...

Supporting structure for a chip and method for producing the same

Method of marking substandard parts

Leadframe and component with a leadframe

Support matrix for integrated semiconductors, and method for produc...

Support matrix with bonding channel for integrated semiconductors,...