Ko-Chin Yang

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Taipei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Chip package structure
- Patent number 10,622,326
- Issue date Apr 14, 2020
- Industrial Technology Research Institute
- Chen-Tsai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separating device and separating method
- Patent number 10,384,434
- Issue date Aug 20, 2019
- Industrial Technology Research Institute
- Chen-Tsai Yang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flexible electronic device and method for manufacturing the same
- Patent number 9,655,244
- Issue date May 16, 2017
- Industrial Technology Research Institute
- Chen-Chu Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a thin film transistor array panelsubstrate
- Patent number 6,913,957
- Issue date Jul 5, 2005
- Quanta Display Inc.
- Ko-Chin Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEPARATING DEVICE AND SEPARATING METHOD
- Publication number 20190061332
- Publication date Feb 28, 2019
- Industrial Technology Research Institute
- Chen-Tsai Yang
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20190057948
- Publication date Feb 21, 2019
- Industrial Technology Research Institute
- Chen-Tsai Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170150604
- Publication date May 25, 2017
- Industrial Technology Research Institute
- Chen-Chu TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
[METHOD OF FABRICATING A THIN FILM TRANSISTOR ARRAY PANELSUBSTRATE]
- Publication number 20040191968
- Publication date Sep 30, 2004
- Ko-Chin Yang
- H01 - BASIC ELECTRIC ELEMENTS