Ko Inaba

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Edogawa-ku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Solder joint
- Patent number 11,628,519
- Issue date Apr 18, 2023
- Lenovo (Singapore) Pte. Ltd.
- Ko Inaba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bonding method and solder joint
- Patent number 11,097,379
- Issue date Aug 24, 2021
- Lenovo (Singapore) Pte. Ltd.
- Ko Inaba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux and solder paste
- Patent number 10,987,764
- Issue date Apr 27, 2021
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder paste and its use
- Patent number 8,227,536
- Issue date Jul 24, 2012
- Senju Metal Industry Co., Ltd.
- Shizuharu Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER JOINT
- Publication number 20210316406
- Publication date Oct 14, 2021
- LENOVO (SINGAPORE) PTE. LTD.
- Ko Inaba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX AND SOLDER PASTE
- Publication number 20210031311
- Publication date Feb 4, 2021
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi KAWASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BONDING METHOD AND SOLDER JOINT
- Publication number 20190193211
- Publication date Jun 27, 2019
- LENOVO (SINGAPORE) PTE. LTD.
- Ko Inaba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Paste and Solder Joint
- Publication number 20170304961
- Publication date Oct 26, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Kazuyori Takagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free Solder Paste and Its Use
- Publication number 20100035072
- Publication date Feb 11, 2010
- Shizuharu Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Soldering a Module Board
- Publication number 20090301760
- Publication date Dec 10, 2009
- Masato Shimamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...