Ko-Pu WU

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame, package structure and method for manufacturing the same
- Patent number 11,450,596
- Issue date Sep 20, 2022
- Advanced Semiconductor Engineering, Inc.
- Yi-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a plurality of leads surrounding a die paddle and...
- Patent number 11,139,225
- Issue date Oct 5, 2021
- Advanced Semiconductor Engineering, Inc.
- Kuang-Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240339383
- Publication date Oct 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ko-Pu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210159155
- Publication date May 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Yi-Cheng HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200395275
- Publication date Dec 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Kuang-Hsiung CHEN
- H01 - BASIC ELECTRIC ELEMENTS