Ko-Yen Lin

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bump coplanarity for semiconductor device assembly and methods of m...
- Patent number 12,154,879
- Issue date Nov 26, 2024
- Micron Technology, Inc.
- Ko Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM structure and method of fabricating the same
- Patent number 11,856,870
- Issue date Dec 26, 2023
- United Microelectronics Corp.
- Kuo-Chih Lai
Information Patent Grant
Bump coplanarity for semiconductor device assembly and methods of m...
- Patent number 11,742,309
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Ko Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM structure and method of fabricating the same
- Patent number 11,404,631
- Issue date Aug 2, 2022
- United Microelectronics Corp.
- Kuo-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of fabricating integrated circuit
- Patent number 10,756,128
- Issue date Aug 25, 2020
- United Microelectronics Corp.
- Kuo-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 10,446,489
- Issue date Oct 15, 2019
- United Microelectronics Corp.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and fabrication method thereof
- Patent number 10,153,231
- Issue date Dec 11, 2018
- United Microelectronics Corp.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming copper material over substrate
- Patent number 10,079,177
- Issue date Sep 18, 2018
- United Microelectronics Corp.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a MIM capacitor
- Patent number 9,966,425
- Issue date May 8, 2018
- United Microelectronics Corp.
- Jen-Po Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING AN INTERCONNECT STRUCTURE
- Publication number 20240332189
- Publication date Oct 3, 2024
- UNITED MICROELECTRONICS CORP.
- Shih-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...
- Publication number 20230402418
- Publication date Dec 14, 2023
- Micron Technology, Inc.
- Ko Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FORMING THE SAME
- Publication number 20230238445
- Publication date Jul 27, 2023
- UNITED MICROELECTRONICS CORP.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220320420
- Publication date Oct 6, 2022
- UNITED MICROELECTRONICS CORP.
- Kuo-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...
- Publication number 20220059485
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Ko Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20200403144
- Publication date Dec 24, 2020
- UNITED MICROELECTRONICS CORP.
- Kuo-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATING INTEGRATED CIRCUIT
- Publication number 20200212090
- Publication date Jul 2, 2020
- UNITED MICROELECTRONICS CORP.
- Kuo-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING INTERCONNECT OF SEMICONDUCTOR DEVICE
- Publication number 20200168450
- Publication date May 28, 2020
- United Microelectronics Corp.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20190067184
- Publication date Feb 28, 2019
- UNITED MICROELECTRONICS CORP.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20180261537
- Publication date Sep 13, 2018
- UNITED MICROELECTRONICS CORP.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20180138263
- Publication date May 17, 2018
- United Microelectronics Corp.
- Ko-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS TRANSCEIVING APPARATUS
- Publication number 20110223872
- Publication date Sep 15, 2011
- National Chiao Tung University
- Sau-Hsuan WU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Person

Patents Grantslast 30 patents

Bump coplanarity for semiconductor device assembly and methods of m...

MRAM structure and method of fabricating the same

Bump coplanarity for semiconductor device assembly and methods of m...

MRAM structure and method of fabricating the same

Integrated circuit device and method of fabricating integrated circuit

Interconnect structure

Interconnect structure and fabrication method thereof

Method for forming copper material over substrate

Method for fabricating a MIM capacitor

Patents Applicationslast 30 patents

METHOD FOR FABRICATING AN INTERCONNECT STRUCTURE

BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FORMING THE SAME

MRAM STRUCTURE AND METHOD OF FABRICATING THE SAME

BUMP COPLANARITY FOR SEMICONDUCTOR DEVICE ASSEMBLY AND METHODS OF M...

MRAM STRUCTURE AND METHOD OF FABRICATING THE SAME

INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATING INTEGRATED CIRCUIT

METHOD FOR FABRICATING INTERCONNECT OF SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE

INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

WIRELESS TRANSCEIVING APPARATUS