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Patents Grants
last 30 patents
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Patent Grant
Method for encapsulating leadframe-mounted integrated circuits
Patent number
6,808,661
Issue date
Oct 26, 2004
ASM Technology Singapore Pte. Ltd.
See Yap Ong
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
Apparatus and method for reducing substrate warpage
Publication number
20040077130
Publication date
Apr 22, 2004
ASM Technology Singapore Pte Ltd
Shu Chuen Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods and apparatus for cleaning an IC encapsulation system
Publication number
20030107142
Publication date
Jun 12, 2003
ASM Technology Singapore Pte Ltd
See Yap Ong
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL