Kock Liang Heng

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of making TSV interconnect structur...
- Patent number 9,054,083
- Issue date Jun 9, 2015
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an interconnect structur...
- Patent number 9,029,193
- Issue date May 12, 2015
- STATS ChipPAC, Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an interconnect structure with TSV usin...
- Patent number 8,659,162
- Issue date Feb 25, 2014
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an interposer package wi...
- Patent number 8,263,439
- Issue date Sep 11, 2012
- STATS ChipPAC, Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer integrated with permanent carrier and method therefor
- Patent number 8,125,073
- Issue date Feb 28, 2012
- STATS ChipPAC, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an interconnect structur...
- Patent number 8,067,308
- Issue date Nov 29, 2011
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an interconnect structur...
- Patent number 8,049,328
- Issue date Nov 1, 2011
- STATS ChipPAC, Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer integrated with permanent carrier and method therefor
- Patent number 7,880,293
- Issue date Feb 1, 2011
- STATS ChipPAC, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an interposer package wi...
- Patent number 7,838,337
- Issue date Nov 23, 2010
- STATS ChipPAC, Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an interconnect structur...
- Patent number 7,741,148
- Issue date Jun 22, 2010
- STATS ChipPAC, Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Having an Interconnect Structure with TSV Usin...
- Publication number 20140110861
- Publication date Apr 24, 2014
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having an Interconnect Structure with TSV Usin...
- Publication number 20120013004
- Publication date Jan 19, 2012
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Integrated With Permanent Carrier and Method Therefor
- Publication number 20110101509
- Publication date May 5, 2011
- STATS ChipPAC, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Interposer Package wi...
- Publication number 20110024916
- Publication date Feb 3, 2011
- STATS ChipPAC, Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Interconnect Structur...
- Publication number 20100308443
- Publication date Dec 9, 2010
- STATS ChipPAC, Ltd.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Interconnect Structur...
- Publication number 20100221873
- Publication date Sep 2, 2010
- STATS ChipPAC, Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Interconnect Structur...
- Publication number 20100213610
- Publication date Aug 26, 2010
- STATS ChipPAC, Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING AN INTERCONNECT STRUCTUR...
- Publication number 20100140815
- Publication date Jun 10, 2010
- STATS ChipPAC, Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Interposer Package wi...
- Publication number 20100133704
- Publication date Jun 3, 2010
- STATS ChipPAC, Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Integrated with Permanent Carrier and Method Therefor
- Publication number 20090243083
- Publication date Oct 1, 2009
- STATS ChipPAC, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS

Kock Liang Heng

Person

Patents Grantslast 30 patents

Semiconductor device and method of making TSV interconnect structur...

Semiconductor device and method of forming an interconnect structur...

Semiconductor device having an interconnect structure with TSV usin...

Semiconductor device and method of forming an interposer package wi...

Wafer integrated with permanent carrier and method therefor

Semiconductor device and method of forming an interconnect structur...

Semiconductor device and method of forming an interconnect structur...

Wafer integrated with permanent carrier and method therefor

Semiconductor device and method of forming an interposer package wi...

Semiconductor device and method of forming an interconnect structur...

Patents Applicationslast 30 patents

Semiconductor Device Having an Interconnect Structure with TSV Usin...

Semiconductor Device Having an Interconnect Structure with TSV Usin...

Wafer Integrated With Permanent Carrier and Method Therefor

Semiconductor Device and Method of Forming an Interposer Package wi...

Semiconductor Device and Method of Forming an Interconnect Structur...

Semiconductor Device and Method of Forming an Interconnect Structur...

Semiconductor Device and Method of Forming an Interconnect Structur...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING AN INTERCONNECT STRUCTUR...

Semiconductor Device and Method of Forming an Interposer Package wi...

Wafer Integrated with Permanent Carrier and Method Therefor