Kodai OKOSHI

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Niigata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin composition, semiconductor sealing agent, and semicondu...
- Patent number 10,196,513
- Issue date Feb 5, 2019
- Namics Corporation
- Tomoya Yamazawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition, semiconductor sealing agent, and semicondu...
- Patent number 9,947,604
- Issue date Apr 17, 2018
- Namics Corporation
- Kazuyuki Kohara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDU...
- Publication number 20170022356
- Publication date Jan 26, 2017
- NAMICS CORPORATION
- Tomoya YAMAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDU...
- Publication number 20170005021
- Publication date Jan 5, 2017
- Namics Corporation
- Kazuyuki KOHARA
- H01 - BASIC ELECTRIC ELEMENTS