Koei Nishiura

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated cooling system for electronics testing apparatus
- Patent number 10,297,339
- Issue date May 21, 2019
- Advantest Corporation
- Brent Thordarson
- G11 - INFORMATION STORAGE
Information Patent Grant
Board assembly, electronic device test apparatus and water jacket
- Patent number 9,081,054
- Issue date Jul 14, 2015
- Advantest Corporation
- Koei Nishiura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Water jacket for cooling an electronic device on a board
- Patent number 8,391,006
- Issue date Mar 5, 2013
- Advantest Corporation
- Koei Nishiura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink structure and test head with same
- Patent number 7,990,716
- Issue date Aug 2, 2011
- Advantest Corporation
- Koei Nishiura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device mounted apparatus, test head, and electronic device test system
- Patent number 7,863,916
- Issue date Jan 4, 2011
- Advantest Corporation
- Koei Nishiura
- G01 - MEASURING TESTING
Information Patent Grant
Thermal transferring member, test board and test apparatus
- Patent number 7,307,438
- Issue date Dec 11, 2007
- Advantest Corporation
- Atsushi Ono
- G01 - MEASURING TESTING
Information Patent Grant
Gas collecting device, test head and IC device testing apparatus
- Patent number 7,072,180
- Issue date Jul 4, 2006
- Advantest Corporation
- Koei Nishiura
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED COOLING SYSTEM FOR ELECTRONICS TESTING APPARATUS
- Publication number 20150233967
- Publication date Aug 20, 2015
- Advantest Corporation
- Brent THORDARSON
- G01 - MEASURING TESTING
Information Patent Application
BOARD ASSEMBLY, ELECTRONIC DEVICE TEST APPARATUS AND WATER JACKET
- Publication number 20120320527
- Publication date Dec 20, 2012
- Advantest Corporation
- Koei NISHIURA
- G01 - MEASURING TESTING
Information Patent Application
TEST APPARATUS AND CONNECTION DEVICE
- Publication number 20110248737
- Publication date Oct 13, 2011
- Advantest Corporation
- Satoshi TAKESHITA
- G01 - MEASURING TESTING
Information Patent Application
WATER JACKET FOR COOLING AN ELECTRONIC DEVICE ON A BOARD
- Publication number 20100271779
- Publication date Oct 28, 2010
- Advantest Corporation
- Koei Nishiura
- G01 - MEASURING TESTING
Information Patent Application
HEAT SINK STRUCTURE AND TEST HEAD WITH SAME
- Publication number 20100148792
- Publication date Jun 17, 2010
- Advantest Corporation
- Koei Nishiura
- G01 - MEASURING TESTING
Information Patent Application
DEVICE MOUNTED APPARATUS, TEST HEAD, AND ELECTRONIC DEVICE TEST SYSTEM
- Publication number 20090027073
- Publication date Jan 29, 2009
- Advantest Corporation
- Koei Nishiura
- G01 - MEASURING TESTING
Information Patent Application
Thermal transferring member, test board and test apparatus
- Publication number 20060192580
- Publication date Aug 31, 2006
- Advantest Corporation
- Atsushi Ono
- G01 - MEASURING TESTING
Information Patent Application
Gas collecting device, test head and IC device testing apparatus
- Publication number 20050056102
- Publication date Mar 17, 2005
- Advantest Corporation
- Koei Nishiura
- G01 - MEASURING TESTING

Koei Nishiura

Person

Patents Grantslast 30 patents

Integrated cooling system for electronics testing apparatus

Board assembly, electronic device test apparatus and water jacket

Water jacket for cooling an electronic device on a board

Heat sink structure and test head with same

Device mounted apparatus, test head, and electronic device test system

Thermal transferring member, test board and test apparatus

Gas collecting device, test head and IC device testing apparatus

Patents Applicationslast 30 patents

INTEGRATED COOLING SYSTEM FOR ELECTRONICS TESTING APPARATUS

BOARD ASSEMBLY, ELECTRONIC DEVICE TEST APPARATUS AND WATER JACKET

TEST APPARATUS AND CONNECTION DEVICE

WATER JACKET FOR COOLING AN ELECTRONIC DEVICE ON A BOARD

HEAT SINK STRUCTURE AND TEST HEAD WITH SAME

DEVICE MOUNTED APPARATUS, TEST HEAD, AND ELECTRONIC DEVICE TEST SYSTEM

Thermal transferring member, test board and test apparatus

Gas collecting device, test head and IC device testing apparatus