Kohei MIKI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor element comprising a MIM capacitor and a via hole, a...
- Patent number 11,881,516
- Issue date Jan 23, 2024
- Mitsubishi Electric Corporation
- Kohei Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,777,643
- Issue date Sep 15, 2020
- Mitsubishi Electric Corporation
- Kohei Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,622,216
- Issue date Apr 14, 2020
- Mitsubishi Electric Corporation
- Kohei Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,805,978
- Issue date Oct 31, 2017
- Mitsubishi Electric Corporation
- Kohei Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,773,703
- Issue date Sep 26, 2017
- Mitsubishi Electric Corporation
- Kohei Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing via hole in a semiconductor device
- Patent number 8,455,358
- Issue date Jun 4, 2013
- Mitsubishi Electric Corporation
- Kohei Miki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING SAME
- Publication number 20220290327
- Publication date Sep 15, 2022
- Mitsubishi Electric Corporation
- Yuki TAKETOMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR ELEMENT STRUCTURE
- Publication number 20210384312
- Publication date Dec 9, 2021
- Mitsubishi Electric Corporation
- Kohei MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190378897
- Publication date Dec 12, 2019
- Mitsubishi Electric Corporation
- Kohei MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180342400
- Publication date Nov 29, 2018
- Mitsubishi Electric Corporation
- Kohei MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180342588
- Publication date Nov 29, 2018
- Mitsubishi Electric Corporation
- Kohei MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170162439
- Publication date Jun 8, 2017
- Mitsubishi Electric Corporation
- Kohei MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING VIA HOLE AND METHOD OF MANUFACTURING SEMICO...
- Publication number 20120115327
- Publication date May 10, 2012
- Mitsubishi Electric Corporation
- Kohei MIKI
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor element comprising a MIM capacitor and a via hole, a...

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing via hole in a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR ELEMENT STRUCTURE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING VIA HOLE AND METHOD OF MANUFACTURING SEMICO...