Kohei SEYAMA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mounting apparatus
- Patent number 12,191,276
- Issue date Jan 7, 2025
- Shinkawa Ltd.
- Alexander Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing device and manufacturing method
- Patent number 12,176,317
- Issue date Dec 24, 2024
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing apparatus of semiconductor device
- Patent number 12,131,921
- Issue date Oct 29, 2024
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement apparatus and arrangement method
- Patent number 12,112,962
- Issue date Oct 8, 2024
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,769,749
- Issue date Sep 26, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 11,749,541
- Issue date Sep 5, 2023
- Shinkawa Ltd.
- Shigeyuki Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,664,344
- Issue date May 30, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,616,041
- Issue date Mar 28, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing structure, and structure
- Patent number 11,569,192
- Issue date Jan 31, 2023
- Shinkawa Ltd.
- Yuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus including a heater and a cooling flow path used f...
- Patent number 11,508,688
- Issue date Nov 22, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure with movement mechanism
- Patent number 11,509,126
- Issue date Nov 22, 2022
- Shinkawa Ltd.
- Kohei Seyama
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Device and method for linearly moving first and second moving bodie...
- Patent number 11,469,125
- Issue date Oct 11, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 11,410,960
- Issue date Aug 9, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for linearly moving movable body relative to o...
- Patent number 11,410,866
- Issue date Aug 9, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,393,700
- Issue date Jul 19, 2022
- Yamaha Motor Robotics Holdings Co., Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting device
- Patent number 11,373,975
- Issue date Jun 28, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting head
- Patent number 11,302,666
- Issue date Apr 12, 2022
- Shinkawa Ltd.
- Manato Nishide
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method for manufacturing semiconductor device, and mounting apparatus
- Patent number 11,062,964
- Issue date Jul 13, 2021
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting apparatus
- Patent number 10,910,248
- Issue date Feb 2, 2021
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 10,568,245
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component handling unit
- Patent number 10,497,590
- Issue date Dec 3, 2019
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and measuring method
- Patent number 10,492,351
- Issue date Nov 26, 2019
- Shinkawa Ltd.
- Akira Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus
- Patent number 10,477,697
- Issue date Nov 12, 2019
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heater for bonding apparatus and method of cooling the same
- Patent number 10,350,692
- Issue date Jul 16, 2019
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus
- Patent number 10,340,163
- Issue date Jul 2, 2019
- Shinkawa Ltd.
- Kohei Seyama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic component mounting apparatus
- Patent number 10,181,451
- Issue date Jan 15, 2019
- Shinkawa Ltd.
- Akira Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux reservoir apparatus
- Patent number 10,137,519
- Issue date Nov 27, 2018
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 9,968,020
- Issue date May 8, 2018
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding tool cooling apparatus and method for cooling bonding tool
- Patent number 9,576,927
- Issue date Feb 21, 2017
- Shinkawa Ltd.
- Osamu Kakutani
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING APPARATUS, MOUNTING METHOD, AND RECORDING MEDIUM
- Publication number 20250014921
- Publication date Jan 9, 2025
- SHINKAWA LTD.
- Kohei SEYAMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...
- Publication number 20240304592
- Publication date Sep 12, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS, MOUNTING METHOD, AND RECORDING MEDIUM
- Publication number 20240162073
- Publication date May 16, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER AND BONDING SYSTEM
- Publication number 20240014167
- Publication date Jan 11, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
- Publication number 20230352324
- Publication date Nov 2, 2023
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITION CONTROL APPARATUS, POSITION CONTROL METHOD, POSITION CONTR...
- Publication number 20230273599
- Publication date Aug 31, 2023
- SHINKAWA LTD.
- Kohei SEYAMA
- G05 - CONTROLLING REGULATING
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230274951
- Publication date Aug 31, 2023
- SHINKAWA LTD.
- Yuichiro NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20230268313
- Publication date Aug 24, 2023
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20230154775
- Publication date May 18, 2023
- SHINKAWA LTD.
- Yuji EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20220415845
- Publication date Dec 29, 2022
- SHINKAWA LTD.
- Alexander DZHANGIROV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT APPARATUS AND ARRANGEMENT METHOD
- Publication number 20220319885
- Publication date Oct 6, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20220319891
- Publication date Oct 6, 2022
- SHINKAWA LTD.
- Yuji EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20220320034
- Publication date Oct 6, 2022
- SHINKAWA LTD.
- Hijiri HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20220254751
- Publication date Aug 11, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUC...
- Publication number 20220223450
- Publication date Jul 14, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE
- Publication number 20220216078
- Publication date Jul 7, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
BONDING APPARATUS
- Publication number 20220165591
- Publication date May 26, 2022
- SHINKAWA LTD.
- Shigeyuki SEKIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20220130796
- Publication date Apr 28, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20210225799
- Publication date Jul 22, 2021
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETACHMENT DEVICE
- Publication number 20210197543
- Publication date Jul 1, 2021
- SHINKAWA LTD.
- Hiromi SHIBAHARA
- B32 - LAYERED PRODUCTS
Information Patent Application
FLUX TRANSFER APPARATUS
- Publication number 20210185828
- Publication date Jun 17, 2021
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING APPARATUS
- Publication number 20210175201
- Publication date Jun 10, 2021
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT
- Publication number 20200411352
- Publication date Dec 31, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20200388507
- Publication date Dec 10, 2020
- Yamaha Motor Robotics Holdings Co., Ltd.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING DEVICE
- Publication number 20200373275
- Publication date Nov 26, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE
- Publication number 20200339375
- Publication date Oct 29, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
BONDING DEVICE
- Publication number 20200286850
- Publication date Sep 10, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR LINEARLY MOVING FIRST AND SECOND MOVING BODIE...
- Publication number 20200279762
- Publication date Sep 3, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR POSITIONING FIRST OBJECT IN RELATION TO SECON...
- Publication number 20200251369
- Publication date Aug 6, 2020
- SHINKAWA LTD.
- Tetsuya UTANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE
- Publication number 20200083190
- Publication date Mar 12, 2020
- SHINKAWA LTD.
- Yuji EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS

Kohei SEYAMA

Person

Patents Grantslast 30 patents

Mounting apparatus

Semiconductor device manufacturing device and manufacturing method

Manufacturing apparatus of semiconductor device

Arrangement apparatus and arrangement method

Mounting apparatus

Bonding apparatus

Mounting apparatus

Mounting apparatus

Method for producing structure, and structure

Bonding apparatus including a heater and a cooling flow path used f...

Wiring structure with movement mechanism

Device and method for linearly moving first and second moving bodie...

Bonding apparatus

Apparatus and method for linearly moving movable body relative to o...

Bonding apparatus and bonding method

Electronic component mounting device

Mounting head

Device and method for positioning first object in relation to secon...

Method for manufacturing semiconductor device, and mounting apparatus

Electronic component mounting apparatus

Electronic-component mounting apparatus

Electronic component handling unit

Mounting apparatus and measuring method

Mounting apparatus

Heater for bonding apparatus and method of cooling the same

Mounting apparatus

Electronic component mounting apparatus

Flux reservoir apparatus

Electronic-component mounting apparatus

Bonding tool cooling apparatus and method for cooling bonding tool

Patents Applicationslast 30 patents

MOUNTING APPARATUS, MOUNTING METHOD, AND RECORDING MEDIUM

BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...

MOUNTING APPARATUS, MOUNTING METHOD, AND RECORDING MEDIUM

SUBSTRATE HOLDER AND BONDING SYSTEM

MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE

POSITION CONTROL APPARATUS, POSITION CONTROL METHOD, POSITION CONTR...

MOUNTING DEVICE AND MOUNTING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

MOUNTING APPARATUS

ARRANGEMENT APPARATUS AND ARRANGEMENT METHOD

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

MOUNTING APPARATUS

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

APPARATUS FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUC...

MOUNTING DEVICE

BONDING APPARATUS

MOUNTING APPARATUS

BONDING APPARATUS

DETACHMENT DEVICE

FLUX TRANSFER APPARATUS

MOUNTING APPARATUS

DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT

BONDING DEVICE AND BONDING METHOD

ELECTRONIC COMPONENT MOUNTING DEVICE

WIRING STRUCTURE

BONDING DEVICE

DEVICE AND METHOD FOR LINEARLY MOVING FIRST AND SECOND MOVING BODIE...

DEVICE AND METHOD FOR POSITIONING FIRST OBJECT IN RELATION TO SECON...

METHOD FOR PRODUCING STRUCTURE, AND STRUCTURE