Kohei Takeda

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Curable resin composition, adhesive agent, adhesive film, circuit s...
- Patent number 12,139,576
- Issue date Nov 12, 2024
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Curable resin composition, adhesive, imide oligomer, imide oligomer...
- Patent number 11,802,177
- Issue date Oct 31, 2023
- Sekisui Chemical Co., Ltd.
- Kohei Takeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable resin composition, adhesive, imide oligomer, imide oligomer...
- Patent number 11,753,499
- Issue date Sep 12, 2023
- Sekisui Chemical Co., Ltd.
- Kohei Takeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable resin composition, cured product, adhesive, bonding film, c...
- Patent number 11,421,107
- Issue date Aug 23, 2022
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive film for semiconductor chip with through electrode
- Patent number 10,131,826
- Issue date Nov 20, 2018
- Sekisui Chemical Co., Ltd.
- Mai Nagata
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Adhesive for electronic components
- Patent number 8,901,207
- Issue date Dec 2, 2014
- Sekisui Chemical Co., Ltd.
- Akinobu Hayakawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of producing semiconductor chip laminate comprising an adhes...
- Patent number 8,563,362
- Issue date Oct 22, 2013
- Sekisui Chemical Co., Ltd.
- Akinobu Hayakawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Adhesive for electronic component
- Patent number 7,838,577
- Issue date Nov 23, 2010
- Sekisui Chemical Co., Ltd.
- Akinobu Hayakawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
CURABLE RESIN COMPOSITION, ADHESIVE, IMIDE OLIGOMER, IMIDE OLIGOMER...
- Publication number 20210130536
- Publication date May 6, 2021
- Sekisui Chemical Co., Ltd
- Kohei TAKEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE, BONDING FILM, C...
- Publication number 20210130614
- Publication date May 6, 2021
- Sekisui Chemical Co., Ltd
- Sayaka WAKIOKA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION, ADHESIVE AGENT, ADHESIVE FILM, CIRCUIT S...
- Publication number 20210009749
- Publication date Jan 14, 2021
- Sekisui Chemical Co., Ltd
- Sayaka WAKIOKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR CHIP WITH THROUGH ELECTRODE
- Publication number 20170183548
- Publication date Jun 29, 2017
- Sekisui Chemical Co., Ltd
- Mai NAGATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FO PRODUCING SEMICONDUCTOR CHIP STACK, AND SEMICONDUCTOR DEVICE
- Publication number 20120021233
- Publication date Jan 26, 2012
- SEKISUI CHEMICAL CO., LTD.
- Akinobu Hayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR ELECTRONIC COMPONENTS
- Publication number 20120016057
- Publication date Jan 19, 2012
- Akinobu Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FOR ELECTRONIC COMPONENT
- Publication number 20100197830
- Publication date Aug 5, 2010
- Sekisui Chemical Co., Ltd.
- Akinobu Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FOR ELECTRONIC COMPONENTS
- Publication number 20100076119
- Publication date Mar 25, 2010
- Sekisui Chemical Co., Ltd
- Hideaki Ishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Kohei Takeda

Person

Patents Grantslast 30 patents

Curable resin composition, adhesive agent, adhesive film, circuit s...

Curable resin composition, adhesive, imide oligomer, imide oligomer...

Curable resin composition, adhesive, imide oligomer, imide oligomer...

Curable resin composition, cured product, adhesive, bonding film, c...

Adhesive film for semiconductor chip with through electrode

Adhesive for electronic components

Method of producing semiconductor chip laminate comprising an adhes...

Adhesive for electronic component

Patents Applicationslast 30 patents

CURABLE RESIN COMPOSITION, ADHESIVE, IMIDE OLIGOMER, IMIDE OLIGOMER...

CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE, BONDING FILM, C...

CURABLE RESIN COMPOSITION, ADHESIVE AGENT, ADHESIVE FILM, CIRCUIT S...

ADHESIVE FILM FOR SEMICONDUCTOR CHIP WITH THROUGH ELECTRODE

METHOD FO PRODUCING SEMICONDUCTOR CHIP STACK, AND SEMICONDUCTOR DEVICE

ADHESIVE FOR ELECTRONIC COMPONENTS

ADHESIVE FOR ELECTRONIC COMPONENT

ADHESIVE FOR ELECTRONIC COMPONENTS