Kohei Tatsumi

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor element bonding structure, method for producing semic...
- Patent number 11,810,885
- Issue date Nov 7, 2023
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module device
- Patent number 11,152,286
- Issue date Oct 19, 2021
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure, lead frame, and method for forming...
- Patent number 10,903,146
- Issue date Jan 26, 2021
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal joining structure using metal nanoparticles and metal joining...
- Patent number 9,960,140
- Issue date May 1, 2018
- Nippon Steel & Sumitomo Metal Corporation
- Kohei Tatsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device, method of manufacturing the device and...
- Patent number 9,059,003
- Issue date Jun 16, 2015
- NIPPON MICROMETAL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball mounting method and apparatus
- Patent number 8,104,663
- Issue date Jan 31, 2012
- Nippon Steel Materials Co., Ltd.
- Shinji Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor mounting bonding wire
- Patent number 8,097,960
- Issue date Jan 17, 2012
- Nippon Steel Materials Co., Ltd.
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC single-crystal substrate and method of producing SiC single-cry...
- Patent number 8,044,408
- Issue date Oct 25, 2011
- Nippon Steel Corporation
- Tatsuo Fujimoto
- C30 - CRYSTAL GROWTH
Information Patent Grant
Bonding wire for semiconductor device and method for producing the...
- Patent number 7,969,021
- Issue date Jun 28, 2011
- Nippon Steel Corporation
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold bonding wires for semiconductor devices and method of producin...
- Patent number 7,390,370
- Issue date Jun 24, 2008
- Nippon Steel Corporation
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Ball transferring method and apparatus
- Patent number 7,285,486
- Issue date Oct 23, 2007
- Nippon Steel Materials Co., Ltd.
- Kenji Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a semiconductor devices provided with low me...
- Patent number 7,045,389
- Issue date May 16, 2006
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device provided with low melting point metal bumps
- Patent number 7,045,388
- Issue date May 16, 2006
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball transferring method and apparatus
- Patent number 6,916,731
- Issue date Jul 12, 2005
- Nippon Steel Corporation
- Kenji Shimokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spherical semiconductor device and method for fabricating the same
- Patent number 6,909,182
- Issue date Jun 21, 2005
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of partially plating substrate for electronic devices
- Patent number 6,884,708
- Issue date Apr 26, 2005
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-arranging substrate for forming bump, ball-arranging head, bal...
- Patent number 6,571,007
- Issue date May 27, 2003
- Nippon Steel Corporation
- Kenji Shimokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spherical semiconductor device and method for fabricating the same
- Patent number 6,509,645
- Issue date Jan 21, 2003
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold alloy thin wire for semiconductor devices
- Patent number 6,210,637
- Issue date Apr 3, 2001
- Nippon Steel Corporation
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Gold alloy thin wire for semiconductor devices
- Patent number 6,080,492
- Issue date Jun 27, 2000
- Nippon Steel Corporation
- Tomohiro Uno
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Process and apparatus for forming ball bumps
- Patent number 5,857,610
- Issue date Jan 12, 1999
- Nippon Steel Corporation
- Hiroshi Hoshiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for forming ball bumps
- Patent number 5,803,339
- Issue date Sep 8, 1998
- Nippon Steel Corporation
- Hiroshi Hoshiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for forming ball bumps
- Patent number 5,687,901
- Issue date Nov 18, 1997
- Nippon Steel Corporation
- Hiroshi Hoshiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating resin-coated bonding wire
- Patent number 5,639,558
- Issue date Jun 17, 1997
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire with heat and abrasion resistant coating layers
- Patent number 5,554,443
- Issue date Sep 10, 1996
- Texas Instruments Incorporated
- Hiroyuki Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-coated bonding device
- Patent number 5,415,922
- Issue date May 16, 1995
- Texas Instruments Incorporated
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
JOINING STRUCTURE AND MANUFACTURING METHOD FOR SAME
- Publication number 20240165921
- Publication date May 23, 2024
- Waseda University
- Kohei TATSUMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLAR BATTERY MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240128391
- Publication date Apr 18, 2024
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT BONDING STRUCTURE, METHOD FOR PRODUCING SEMIC...
- Publication number 20210225794
- Publication date Jul 22, 2021
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190229103
- Publication date Jul 25, 2019
- Waseda University
- Kohei TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE DEVICE AND POWER SEMICONDUCTOR MODULE MA...
- Publication number 20190198428
- Publication date Jun 27, 2019
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE CONNECTION STRUCTURE, LEAD FRAME, AND METHOD FOR FORMING...
- Publication number 20190103341
- Publication date Apr 4, 2019
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL JOINING STRUCTURE USING METAL NANOPARTICLES AND METAL JOINING...
- Publication number 20160240505
- Publication date Aug 18, 2016
- NIPPON STEEL & SUMITOMO METAL CORPORATION
- Kohei TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE CONNECTION STRUCTURE AND ELECTRODE CONNECTION METHOD
- Publication number 20160225730
- Publication date Aug 4, 2016
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SAW WIRE AND METHOD OF MANUFACTURING SAW WIRE
- Publication number 20110308371
- Publication date Dec 22, 2011
- Nippon Steel Materials Co., Ltd.
- Mitsuru Morita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-BALL REMOVAL METHOD AND REMOVAL DEVICE, AND MICRO-BALL COLLEC...
- Publication number 20110107580
- Publication date May 12, 2011
- Shinji Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIC SINGLE-CRYSTAL SUBSTRATE AND METHOD OF PRODUCING SIC SINGLE-CRY...
- Publication number 20100295059
- Publication date Nov 25, 2010
- NIPPON STEEL CORPORATION
- Tatsuo FUJIMOTO
- C30 - CRYSTAL GROWTH
Information Patent Application
SOLDER BALL MOUNTING METHOD AND APPARATUS
- Publication number 20100127049
- Publication date May 27, 2010
- Shinji Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MOUNTING BONDING WIRE
- Publication number 20090072399
- Publication date Mar 19, 2009
- Nippon Steel Materials Co., Ltd.
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball transferring method and apparatus
- Publication number 20080032495
- Publication date Feb 7, 2008
- Nippon Steel Materials Co., Ltd.
- Kenji Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball transferring method and apparatus
- Publication number 20050176176
- Publication date Aug 11, 2005
- NIPPON STEEL CORPORATION
- Kenji Shimokawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer-level package and method for production thereof
- Publication number 20050173809
- Publication date Aug 11, 2005
- Yukihiro Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gold alloy bonding wire for semiconductor device and process for pr...
- Publication number 20050079347
- Publication date Apr 14, 2005
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SPHERICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20040061224
- Publication date Apr 1, 2004
- NIPPON STEEL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding wire for semiconductor and method of manufacturing the bond...
- Publication number 20040014266
- Publication date Jan 22, 2004
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Spherical semiconductor device and method for fabricating the same
- Publication number 20030020164
- Publication date Jan 30, 2003
- Nippon Steel Corporation
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball transferring method and apparatus
- Publication number 20020137324
- Publication date Sep 26, 2002
- Kenji Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spherical semiconductor device and method for fabricating the same
- Publication number 20020132462
- Publication date Sep 19, 2002
- NIPPON STEEL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method to produce the same
- Publication number 20020113322
- Publication date Aug 22, 2002
- Shinichi Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PROVIDED WITH LOW MELTING POINT METAL BUMPS
- Publication number 20020036344
- Publication date Mar 28, 2002
- KOHEI TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPHERICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20020011665
- Publication date Jan 31, 2002
- KOHEI TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PARTIALLY PLATING SUBSTRATE FOR ELECTRONIC DEVICES
- Publication number 20010012683
- Publication date Aug 9, 2001
- KOHEI TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS

Kohei Tatsumi

Person

Patents Grantslast 30 patents

Semiconductor element bonding structure, method for producing semic...

Power semiconductor module device

Electrode connection structure, lead frame, and method for forming...

Metal joining structure using metal nanoparticles and metal joining...

Electrode connection structure and electrode connection method

Power semiconductor device, method of manufacturing the device and...

Solder ball mounting method and apparatus

Semiconductor mounting bonding wire

SiC single-crystal substrate and method of producing SiC single-cry...

Bonding wire for semiconductor device and method for producing the...

Gold bonding wires for semiconductor devices and method of producin...

Ball transferring method and apparatus

Method for fabricating a semiconductor devices provided with low me...

Semiconductor device provided with low melting point metal bumps

Ball transferring method and apparatus

Spherical semiconductor device and method for fabricating the same

Method of partially plating substrate for electronic devices

Ball-arranging substrate for forming bump, ball-arranging head, bal...

Spherical semiconductor device and method for fabricating the same

Gold alloy thin wire for semiconductor devices

Gold alloy thin wire for semiconductor devices

Process and apparatus for forming ball bumps

Process and apparatus for forming ball bumps

Process and apparatus for forming ball bumps

Insulating resin-coated bonding wire

Bonding wire with heat and abrasion resistant coating layers

Resin-coated bonding device

Patents Applicationslast 30 patents

JOINING STRUCTURE AND MANUFACTURING METHOD FOR SAME

SOLAR BATTERY MODULE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR ELEMENT BONDING STRUCTURE, METHOD FOR PRODUCING SEMIC...

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE DEVICE AND POWER SEMICONDUCTOR MODULE MA...

ELECTRODE CONNECTION STRUCTURE, LEAD FRAME, AND METHOD FOR FORMING...

METAL JOINING STRUCTURE USING METAL NANOPARTICLES AND METAL JOINING...

ELECTRODE CONNECTION STRUCTURE AND ELECTRODE CONNECTION METHOD

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

SAW WIRE AND METHOD OF MANUFACTURING SAW WIRE

MICRO-BALL REMOVAL METHOD AND REMOVAL DEVICE, AND MICRO-BALL COLLEC...

SIC SINGLE-CRYSTAL SUBSTRATE AND METHOD OF PRODUCING SIC SINGLE-CRY...

SOLDER BALL MOUNTING METHOD AND APPARATUS

SEMICONDUCTOR MOUNTING BONDING WIRE

Ball transferring method and apparatus

Ball transferring method and apparatus

Wafer-level package and method for production thereof

Gold alloy bonding wire for semiconductor device and process for pr...

SPHERICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Bonding wire for semiconductor and method of manufacturing the bond...

Spherical semiconductor device and method for fabricating the same

Ball transferring method and apparatus

Spherical semiconductor device and method for fabricating the same

Semiconductor device and method to produce the same

SEMICONDUCTOR DEVICE PROVIDED WITH LOW MELTING POINT METAL BUMPS

SPHERICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF PARTIALLY PLATING SUBSTRATE FOR ELECTRONIC DEVICES