Kohei Tsujimoto

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer and method of processing wafer
- Patent number 10,115,578
- Issue date Oct 30, 2018
- Disco Corporation
- Ryosuke Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 9,786,509
- Issue date Oct 10, 2017
- Disco Corporation
- Ryosuke Nishihara
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF SHAPING HOLDING SURFACE OF CHUCK TABLE
- Publication number 20240261926
- Publication date Aug 8, 2024
- Disco Corporation
- Tatsuya SUZUKI
- B24 - GRINDING POLISHING
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240153777
- Publication date May 9, 2024
- Disco Corporation
- Kohei TSUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF HANDLING WAFER
- Publication number 20230411180
- Publication date Dec 21, 2023
- Disco Corporation
- Masaru NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRINDING METHOD OF WAFER
- Publication number 20230302599
- Publication date Sep 28, 2023
- Disco Corporation
- Tatsuya SUZUKI
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20210057261
- Publication date Feb 25, 2021
- Disco Corporation
- Kohei TSUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND METHOD OF PROCESSING WAFER
- Publication number 20180076016
- Publication date Mar 15, 2018
- Disco Corporation
- Ryosuke Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20160064230
- Publication date Mar 3, 2016
- Disco Corporation
- Ryosuke Nishihara
- H01 - BASIC ELECTRIC ELEMENTS