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Kohichi OHSUMI
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Yasu-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Wiring board for fingerprint sensor
Patent number
9,928,400
Issue date
Mar 27, 2018
Kyocera Corporation
Kohichi Ohsumi
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method of manufacturing printed circuit board
Patent number
8,578,601
Issue date
Nov 12, 2013
KYOCERA SLC Technologies Corporation
Kohichi Ohsumi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board and manufacturing method thereof
Patent number
8,319,115
Issue date
Nov 27, 2012
KYOCERA SLC Technologies Corporation
Kohichi Ohsumi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board and manufacturing method thereof
Patent number
8,304,663
Issue date
Nov 6, 2012
KYOCERA SLC Technologies Corporation
Kohichi Ohsumi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
WIRING BOARD FOR FINGERPRINT SENSOR
Publication number
20170091511
Publication date
Mar 30, 2017
Kyocera Corporation
Kohichi OHSUMI
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHOD FOR PRODUCING WIRING BOARD
Publication number
20150351257
Publication date
Dec 3, 2015
KYOCERA Circuit Solutions, Inc.
Kohichi OHSUMI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING WIRING BOARD
Publication number
20150027977
Publication date
Jan 29, 2015
KYOCERA SLC TECHNOLOGIES CORPORATION
Kohichi OHSUMI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD
Publication number
20140001637
Publication date
Jan 2, 2014
Kohichi OHSUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
Publication number
20120145665
Publication date
Jun 14, 2012
KYOCERA SLC TECHNOLOGIES CORPORATION
Kohichi OHSUMI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wiring Board and Manufacturing Method Thereof
Publication number
20100071950
Publication date
Mar 25, 2010
KYOCERA SLC TECHNOLOGIES CORPORATION
Kohichi OHSUMI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wiring board and manufacturing method thereof
Publication number
20080302563
Publication date
Dec 11, 2008
Kohichi Ohsumi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR