Kohichiro Kawate

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Heat-dissipating resin composition, cured product thereof, and meth...
- Patent number 11,124,646
- Issue date Sep 21, 2021
- 3M Innovative Properties Company
- Kohichiro Kawate
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor package resin composition and usage method thereof
- Patent number 9,773,714
- Issue date Sep 26, 2017
- 3M Innovative Properties Company
- Kohichiro Kawate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill composition and semiconductor device and manufacturing me...
- Patent number 9,281,255
- Issue date Mar 8, 2016
- 3M Innovative Properties Company
- Kohichiro Kawate
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor package resin composition and usage method thereof
- Patent number 9,230,873
- Issue date Jan 5, 2016
- 3M Innovative Properties Company
- Kohichiro Kawate
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Connection method of a flexible printed circuit board with two prin...
- Patent number 7,888,604
- Issue date Feb 15, 2011
- 3M Innovative Properties Company
- Kohichiro Kawate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mutually connecting circuit boards
- Patent number 7,779,538
- Issue date Aug 24, 2010
- 3M Innovative Properties Company
- Yoshiaki Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-curable adhesive composition
- Patent number 7,358,289
- Issue date Apr 15, 2008
- 3M Innovative Properties Company
- Naoyuki Toriumi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Batch electrically connecting sheet
- Patent number 6,908,318
- Issue date Jun 21, 2005
- 3M Innovative Properties Company
- Kohichiro Kawate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat activated adhesive
- Patent number 6,753,379
- Issue date Jun 22, 2004
- 3M Innovative Properties Company
- Kohichiro Kawate
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Hot-melt adhesive composition, heat-bonding film adhesive and adher...
- Patent number 6,265,460
- Issue date Jul 24, 2001
- 3M Innovative Properties Company
- Kohichiro Kawate
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition and precursor thereof
- Patent number 6,228,500
- Issue date May 8, 2001
- 3M Innovative Properties Company
- Yuji Hiroshige
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Reactive hot melt composition, composition for preparation of react...
- Patent number 6,051,652
- Issue date Apr 18, 2000
- 3M Innovative Properties Company
- Kohichiro Kawate
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Sanding pad containing a heat distortable polymer and sanding proce...
- Patent number 5,759,090
- Issue date Jun 2, 1998
- Minnesota Mining and Manufacturing Company
- Kohichiro Kawate
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat-sensitive imaging material
- Patent number 5,382,641
- Issue date Jan 17, 1995
- Minnesota Mining and Manufacturing Company
- Kohichiro Kawate
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
VIBRATION ABSORBING MATERIAL
- Publication number 20210193099
- Publication date Jun 24, 2021
- 3M Innovative Properties Company
- Kohichiro Kawate
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-DISSIPATING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND METH...
- Publication number 20200181393
- Publication date Jun 11, 2020
- 3M Innovative Properties Company
- Kohichiro Kawate
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HIGH THERMAL CONDUCTIVITY PREPREG, PRINTED WIRING BOARD AND MULTILA...
- Publication number 20160007453
- Publication date Jan 7, 2016
- 3M Innovative Properties Company
- Kohichiro Kawate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Package Resin Composition and Usage Method Thereof
- Publication number 20150329740
- Publication date Nov 19, 2015
- 3M Innovative Properties Company
- Kohichiro Kawate
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
UNDERFILL COMPOSITION AND SEMICONDUCTOR DEVICE AND MANUFACTURING ME...
- Publication number 20150332984
- Publication date Nov 19, 2015
- 3M INNOVATIVE PROPERTIES COMPANY
- Kohichiro Kawate
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Package Resin Composition and Usage Method Thereof
- Publication number 20140217622
- Publication date Aug 7, 2014
- Kohichiro Kawate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM LAMINATE BODY FOR PRESSURE SENSITIVE FINGERPRINT SENSOR
- Publication number 20140096622
- Publication date Apr 10, 2014
- 3M Innovative Properties Company
- Kohichiro Kawate
- B32 - LAYERED PRODUCTS
Information Patent Application
TERMINAL MOUNTING STRUCTURE AND METHOD
- Publication number 20110163569
- Publication date Jul 7, 2011
- Miki Yoneyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE
- Publication number 20110000700
- Publication date Jan 6, 2011
- Yoshiaki Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NONCONDUCTIVE ADHESIVE COMPOSITION AND FILM AND METHODS OF MAKING
- Publication number 20100206623
- Publication date Aug 19, 2010
- Kohichiro Kawate
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CABLE HARNESS BODY
- Publication number 20100197368
- Publication date Aug 5, 2010
- 3M Innovative Properties Company
- Yoshihisa Kawate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE COMPOSITION COMPRISING POLYHYDROXYETHER AND ORGANIC PARTIC...
- Publication number 20090321015
- Publication date Dec 31, 2009
- Kohichiro Kawate
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF CONNECTING A SEMICONDUCTOR PACKAGE TO A PRINTED WIRING BOARD
- Publication number 20090127692
- Publication date May 21, 2009
- Kohichiro Kawate
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for Connecting Printed Circuit Boards
- Publication number 20080283280
- Publication date Nov 20, 2008
- Kohichiro Kawate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Mutually Connecting Circuit Boards
- Publication number 20080205019
- Publication date Aug 28, 2008
- Yoshiaki Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection Method of a Flexible Printed Circuit Board with Two Prin...
- Publication number 20080171182
- Publication date Jul 17, 2008
- Kohichiro Kawate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Connecting Flexible Printed Circuit Board to Another Cir...
- Publication number 20080156437
- Publication date Jul 3, 2008
- Kohichiro Kawate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT CURABLE ADHESIVE COMPOSITION, ARTICLE, SEMICONDUCTOR APPARATUS...
- Publication number 20080090085
- Publication date Apr 17, 2008
- 3M Innovative Properties Company
- Kohichiro Kawate
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Nondestructive Inspection Method For Inspecting Junction Of Flexibl...
- Publication number 20080013594
- Publication date Jan 17, 2008
- 3M Innovative Properties Company
- Kohichiro Kawate
- G01 - MEASURING TESTING
Information Patent Application
Connection Method of Conductive Articles, and Electric or Electroni...
- Publication number 20070224397
- Publication date Sep 27, 2007
- Yoshihisa Kawate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat-curable adhesive composition
- Publication number 20060014871
- Publication date Jan 19, 2006
- 3M Innovative Properties Company
- Naoyuki Toriumi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermosetting adhesive sheet with electroconductive and thermocondu...
- Publication number 20050233161
- Publication date Oct 20, 2005
- Masaaki Takeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Heat curable adhesive composition, article, semiconductor apparatus...
- Publication number 20050224978
- Publication date Oct 13, 2005
- Kohichiro Kawate
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BATCH ELECTRICALLY CONNECTING SHEET
- Publication number 20040241402
- Publication date Dec 2, 2004
- Kohichiro Kawate
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sheet for sealing electrical wiring
- Publication number 20040185237
- Publication date Sep 23, 2004
- Kohichiro Kawate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermosetting adhesive film, and an adhesive structure based on the...
- Publication number 20040068061
- Publication date Apr 8, 2004
- Kohichiro Kawate
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting adhesive
- Publication number 20040063804
- Publication date Apr 1, 2004
- Masaaki Takeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Process for producing polymeric films having shape-memorizing prope...
- Publication number 20020056949
- Publication date May 16, 2002
- Takashi Sasaki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Kohichiro Kawate

Person

Patents Grantslast 30 patents

Heat-dissipating resin composition, cured product thereof, and meth...

Semiconductor package resin composition and usage method thereof

Underfill composition and semiconductor device and manufacturing me...

Semiconductor package resin composition and usage method thereof

Connection method of a flexible printed circuit board with two prin...

Method for mutually connecting circuit boards

Heat-curable adhesive composition

Batch electrically connecting sheet

Heat activated adhesive

Hot-melt adhesive composition, heat-bonding film adhesive and adher...

Adhesive composition and precursor thereof

Reactive hot melt composition, composition for preparation of react...

Sanding pad containing a heat distortable polymer and sanding proce...

Heat-sensitive imaging material

Patents Applicationslast 30 patents

VIBRATION ABSORBING MATERIAL

HEAT-DISSIPATING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND METH...

HIGH THERMAL CONDUCTIVITY PREPREG, PRINTED WIRING BOARD AND MULTILA...

Semiconductor Package Resin Composition and Usage Method Thereof

UNDERFILL COMPOSITION AND SEMICONDUCTOR DEVICE AND MANUFACTURING ME...

Semiconductor Package Resin Composition and Usage Method Thereof

FILM LAMINATE BODY FOR PRESSURE SENSITIVE FINGERPRINT SENSOR

TERMINAL MOUNTING STRUCTURE AND METHOD

METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE

NONCONDUCTIVE ADHESIVE COMPOSITION AND FILM AND METHODS OF MAKING

CABLE HARNESS BODY

ADHESIVE COMPOSITION COMPRISING POLYHYDROXYETHER AND ORGANIC PARTIC...

METHOD OF CONNECTING A SEMICONDUCTOR PACKAGE TO A PRINTED WIRING BOARD

Method for Connecting Printed Circuit Boards

Method for Mutually Connecting Circuit Boards

Connection Method of a Flexible Printed Circuit Board with Two Prin...

Method for Connecting Flexible Printed Circuit Board to Another Cir...

HEAT CURABLE ADHESIVE COMPOSITION, ARTICLE, SEMICONDUCTOR APPARATUS...

Nondestructive Inspection Method For Inspecting Junction Of Flexibl...

Connection Method of Conductive Articles, and Electric or Electroni...

Heat-curable adhesive composition

Thermosetting adhesive sheet with electroconductive and thermocondu...

Heat curable adhesive composition, article, semiconductor apparatus...

BATCH ELECTRICALLY CONNECTING SHEET

Sheet for sealing electrical wiring

Thermosetting adhesive film, and an adhesive structure based on the...

Thermosetting adhesive

Process for producing polymeric films having shape-memorizing prope...