Kohji Kimbara

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of producing a polyimide multilayer wiring board
- Patent number 5,426,849
- Issue date Jun 27, 1995
- NEC Corporation
- Kohji Kimbara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimide multilayer wiring board and method of producing same
- Patent number 5,321,210
- Issue date Jun 14, 1994
- NEC Corporation
- Kohji Kimbara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate
- Patent number 5,111,003
- Issue date May 5, 1992
- NEC Corporation
- Kohji Kimbara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate with engineering change pads
- Patent number 4,710,592
- Issue date Dec 1, 1987
- NEC Corporation
- Kohji Kimbara
- H01 - BASIC ELECTRIC ELEMENTS