Kohji SUZUMURA

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Chiyoda-ku, Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Moisture-curable reactive hot-melt adhesive composition and method...
- Patent number 11,624,016
- Issue date Apr 11, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Chika Kuramochi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
MOISTURE-CURABLE REACTIVE HOT-MELT ADHESIVE COMPOSITION AND METHOD...
- Publication number 20190127618
- Publication date May 2, 2019
- Hitachi Chemical Company, Ltd.
- Chika KURAMOCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...