Kohsuke Arai

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Hitachi-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Surface treated copper foil and laminate using the same, printed wi...
- Patent number 9,730,332
- Issue date Aug 8, 2017
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treated copper foil and laminate using the same
- Patent number 9,504,149
- Issue date Nov 22, 2016
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface treated copper foil and laminate using the same
- Patent number 9,232,650
- Issue date Jan 5, 2016
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring B...
- Publication number 20160303829
- Publication date Oct 20, 2016
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface Treated Copper Foil and Laminate Using the Same
- Publication number 20150245477
- Publication date Aug 27, 2015
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATED COPPER FOIL AND LAMINATE USING THE SAME, PRINTED WI...
- Publication number 20150237737
- Publication date Aug 20, 2015
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Treated Copper Foil and Laminate Using the Same
- Publication number 20140355229
- Publication date Dec 4, 2014
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR