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Koichi Ishizuka
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Tokyo, JP
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last 30 patents
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Patent Grant
Method for preparing thin copper foil-clad substrate for circuit bo...
Patent number
4,917,758
Issue date
Apr 17, 1990
Mitsubishi Gas Chemical Company, Inc.
Koichi Ishizuka
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...