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Koichi Kondo

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  • Ota-ku, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Stacked wafer manufacturing method
    • Patent number 8,389,386
    • Issue date Mar 5, 2013
    • Disco Corporation
    • Akihito Kawai
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Processing method for package substrate
    • Patent number 8,198,175
    • Issue date Jun 12, 2012
    • Disco Corporation
    • Kazuma Sekiya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of processing wafer
    • Patent number 7,662,666
    • Issue date Feb 16, 2010
    • Disco Corporation
    • Koichi Kondo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 7,625,810
    • Issue date Dec 1, 2009
    • Disco Corporation
    • Keiichi Kajiyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    DEVICE CHIP, ACCOMMODATING TRAY, AND METHOD OF ACCOMMODATING DEVICE...
    • Publication number 20180108583
    • Publication date Apr 19, 2018
    • Disco Corporation
    • Koichi Kondo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICE CHIP AND MANUFACTURING METHOD THEREFOR
    • Publication number 20130056857
    • Publication date Mar 7, 2013
    • Disco Corporation
    • Koichi KONDO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING MACHINE
    • Publication number 20110266266
    • Publication date Nov 3, 2011
    • Disco Corporation
    • Koichi Kondo
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STACKED WAFER MANUFACTURING METHOD
    • Publication number 20110256667
    • Publication date Oct 20, 2011
    • Disco Corporation
    • Akihito Kawai
    • B24 - GRINDING POLISHING
  • Information Patent Application

    STACKED WAFER MANUFACTURING METHOD
    • Publication number 20110256665
    • Publication date Oct 20, 2011
    • Disco Corporation
    • Akihito Kawai
    • B24 - GRINDING POLISHING
  • Information Patent Application

    PROCESSING METHOD FOR PACKAGE SUBSTRATE
    • Publication number 20110212574
    • Publication date Sep 1, 2011
    • Disco Corporation
    • Kazuma Sekiya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of processing wafer
    • Publication number 20080132035
    • Publication date Jun 5, 2008
    • Disco Corporation
    • Koichi Kondo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Laser processing machine
    • Publication number 20080105665
    • Publication date May 8, 2008
    • Disco Corporation
    • Koichi Kondo
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer processing method
    • Publication number 20060292826
    • Publication date Dec 28, 2006
    • DISCO CORPORATION
    • Keiichi Kajiyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR