Koichi Koyano

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Hadano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Device for sealing and cooling multi-chip modules
- Patent number 6,890,799
- Issue date May 10, 2005
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for sealing and cooling multi-chip modules
- Patent number 6,528,878
- Issue date Mar 4, 2003
- Hitachi, Ltd.
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Device for sealing and cooling multi-chip modules
- Publication number 20030103333
- Publication date Jun 5, 2003
- Hitachi, Ltd
- Takahiro Daikoku
- H01 - BASIC ELECTRIC ELEMENTS