Koichi Kumai

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal foil pattern layered body, metal foil layered body, metal foi...
- Patent number 10,672,928
- Issue date Jun 2, 2020
- DSM IP Assets B.V.
- Koichi Kumai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of manufacturing a circuit board by punching
- Patent number 10,651,320
- Issue date May 12, 2020
- DSM IP Assets B.V.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal foil pattern layered body, metal foil layered body, metal foi...
- Patent number 10,056,517
- Issue date Aug 21, 2018
- DSM IP Assets B.V.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crimp terminal having a conductor crimping part with an intermediat...
- Patent number 9,831,567
- Issue date Nov 28, 2017
- Yazaki Corporation
- Daisuke Miyakawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a circuit board by punching
- Patent number 9,478,674
- Issue date Oct 25, 2016
- DSM IP Assets B.V.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical wiring layer, optoelectric wiring substrate, mounted substr...
- Patent number 6,438,281
- Issue date Aug 20, 2002
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING
- Publication number 20190288127
- Publication date Sep 19, 2019
- DSM IP Assets, B.V.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL PATTERN LAYERED BODY, METAL FOIL LAYERED BODY, METAL FOI...
- Publication number 20170358700
- Publication date Dec 14, 2017
- DSM IP Assets B. V.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRIMP TERMINAL AND MANUFACTURING METHOD OF THE SAME, WIRE ASSEMBLY,...
- Publication number 20170040713
- Publication date Feb 9, 2017
- YAZAKI CORPORATION
- Daisuke MIYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING
- Publication number 20170018660
- Publication date Jan 19, 2017
- DSM IP Assets B. V.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL PATTERN LAYERED BODY, METAL FOIL LAYERED BODY, METAL FOI...
- Publication number 20140090698
- Publication date Apr 3, 2014
- Toppan Printing Co., Ltd.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL PATTERN LAMINATE, METHOD FOR PUNCHING METAL FOIL, CIRCUI...
- Publication number 20130247977
- Publication date Sep 26, 2013
- Toppan Printing Co., Ltd.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS