Koichi Nagao

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,815,255
- Issue date Nov 9, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yukiko Nakaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer, semiconductor device, and method for manufactu...
- Patent number 6,764,879
- Issue date Jul 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Koichi Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having two chips internally connected togethe...
- Patent number 6,677,674
- Issue date Jan 13, 2004
- Matsushita Electric Industrial Co., Ltd.
- Koichi Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,583,512
- Issue date Jun 24, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yukiko Nakaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,558,977
- Issue date May 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yukiko Nakaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing probe card
- Patent number 5,829,126
- Issue date Nov 3, 1998
- Matsushita Electric Industrial Co., Ltd.
- Koichi Nagao
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device checking method
- Patent number 5,665,610
- Issue date Sep 9, 1997
- Matsushita Electric Industrial Co., Ltd.
- Yoshiro Nakata
- G01 - MEASURING TESTING
Information Patent Grant
Inspecting method for semiconductor devices
- Patent number 5,605,844
- Issue date Feb 25, 1997
- Matsushita Electric Industrial Co., Ltd.
- Shinichi Oki
- G01 - MEASURING TESTING
Information Patent Grant
Lead connection structure
- Patent number 5,089,750
- Issue date Feb 18, 1992
- Matsushita Electric Industrial Co., Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead connection structure
- Patent number 4,959,590
- Issue date Sep 25, 1990
- Matsushita Electric Industrial Co., Ltd.
- Kenzo Hatada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040029314
- Publication date Feb 12, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yukiko Nakaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20030127722
- Publication date Jul 10, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yukiko Nakaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030032216
- Publication date Feb 13, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yukiko Nakaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer, semiconductor device, and method for manufactu...
- Publication number 20030032263
- Publication date Feb 13, 2003
- Matsushita Electric Industrial Co., Ltd.
- Koichi Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20020115233
- Publication date Aug 22, 2002
- Matsushita Electric Industrial Co., Ltd.
- Yukio Nakaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20020079590
- Publication date Jun 27, 2002
- Yukiko Nakaoka
- H01 - BASIC ELECTRIC ELEMENTS

Koichi Nagao

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor wafer, semiconductor device, and method for manufactu...

Semiconductor package having two chips internally connected togethe...

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Method of manufacturing probe card

Semiconductor device checking method

Inspecting method for semiconductor devices

Lead connection structure

Lead connection structure

Patents Applicationslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor device and method for fabricating the same

Semiconductor device and manufacturing method thereof

Semiconductor wafer, semiconductor device, and method for manufactu...

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same