Koichi Nagasaki

Person

Kokubu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer heating apparatus and semiconductor manufacturing apparatus
- Patent number 8,519,309
- Issue date Aug 27, 2013
- Kyocera Corporation
- Keiji Iwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer piezoelectric element and injection apparatus using the...
- Patent number 8,378,554
- Issue date Feb 19, 2013
- Kyocera Corporation
- Shigenobu Nakamura
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Grant
Wafer heating apparatus and semiconductor manufacturing apparatus
- Patent number 8,071,916
- Issue date Dec 6, 2011
- Kyocera Corporation
- Keiji Iwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer heating apparatus
- Patent number 6,753,507
- Issue date Jun 22, 2004
- Kyocera Corporation
- Hiroshi Fure
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic chuck and production method therefor
- Patent number 6,215,643
- Issue date Apr 10, 2001
- Kyocera Corporation
- Koichi Nagasaki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wafer holding device
- Patent number 6,108,190
- Issue date Aug 22, 2000
- Kyocera Corporation
- Koichi Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer support member
- Patent number 5,886,863
- Issue date Mar 23, 1999
- Kyocera Corporation
- Koichi Nagasaki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
Multi-Layer Piezoelectric Element and Injection Apparatus Using the...
- Publication number 20100282874
- Publication date Nov 11, 2010
- KYOCERA CORPORATION
- Shigenobu Nakamura
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Application
Wafer Heating Apparatus and Semiconductor Manufacturing Apparatus
- Publication number 20100170884
- Publication date Jul 8, 2010
- Kyocera Corporation
- Keiji Iwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer Heating Apparatus And Semiconductor Manufacturing Apparatus
- Publication number 20080017627
- Publication date Jan 24, 2008
- KYOCERA CORPORATION
- Keiji Iwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermoelectric module and process for producing the same
- Publication number 20040042181
- Publication date Mar 4, 2004
- KYOCERA CORPORATION
- Koichi Nagasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer heating apparatus
- Publication number 20030015517
- Publication date Jan 23, 2003
- Hiroshi Fure
- H01 - BASIC ELECTRIC ELEMENTS

Koichi Nagasaki

Person

Patents Grantslast 30 patents

Wafer heating apparatus and semiconductor manufacturing apparatus

Multi-layer piezoelectric element and injection apparatus using the...

Wafer heating apparatus and semiconductor manufacturing apparatus

Wafer heating apparatus

Electrostatic chuck and production method therefor

Wafer holding device

Wafer support member

Patents Applicationslast 30 patents

Multi-Layer Piezoelectric Element and Injection Apparatus Using the...

Wafer Heating Apparatus and Semiconductor Manufacturing Apparatus

Wafer Heating Apparatus And Semiconductor Manufacturing Apparatus

Thermoelectric module and process for producing the same

Wafer heating apparatus