Koichi Nakayama

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring board
- Patent number 10,765,011
- Issue date Sep 1, 2020
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board
- Patent number 10,477,702
- Issue date Nov 12, 2019
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 9,659,849
- Issue date May 23, 2017
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 9,136,214
- Issue date Sep 15, 2015
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate and method of manufacturing the same
- Patent number 8,623,751
- Issue date Jan 7, 2014
- Dai Nippon Printing Co., Ltd.
- Koichi Nakayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electroconductive material-filled throughh...
- Patent number 8,196,298
- Issue date Jun 12, 2012
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate and method of manufacturing the same
- Patent number 8,198,726
- Issue date Jun 12, 2012
- Dai Nippon Printing Co., Ltd.
- Koichi Nakayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring board
- Patent number 8,069,560
- Issue date Dec 6, 2011
- Dai Nippon Printing Co., Ltd.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electroconductive material-filled throughh...
- Patent number 7,918,020
- Issue date Apr 5, 2011
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board
- Patent number 7,800,002
- Issue date Sep 21, 2010
- Dai Nippon Printing Co., Ltd.
- Shigeki Chujo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multilayer wiring board
- Patent number 7,690,109
- Issue date Apr 6, 2010
- Dai Nippon Printing Co., Ltd.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and manufacture method thereof
- Patent number 7,091,589
- Issue date Aug 15, 2006
- Dai Nippon Printing Co., Ltd.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20190394886
- Publication date Dec 26, 2019
- DAI NIPPON PRINTING CO., LTD.
- Shigeki CHUJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20170223842
- Publication date Aug 3, 2017
- DAI NIPPON PRINTING CO., LTD.
- Shigeki CHUJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20150076107
- Publication date Mar 19, 2015
- DAI NIPPON PRINTING CO., LTD.
- Shigeki CHUJO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120220123
- Publication date Aug 30, 2012
- DAI NIPPON PRINTING CO., LTD.
- Koichi NAKAYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD AND MANUFACTURE METHOD THEREOF
- Publication number 20110035939
- Publication date Feb 17, 2011
- DAI NIPPON PRINTING CO., LTD.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTROCONDUCTIVE MATERIAL-FILLED THROUGHH...
- Publication number 20110023298
- Publication date Feb 3, 2011
- DAI NIPPON PRINTING CO., LTD.
- Shigeki Chujo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100164120
- Publication date Jul 1, 2010
- DAI NIPPON PRINTING CO., LTD.
- Koichi Nakayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20100116782
- Publication date May 13, 2010
- DAI NIPPON PRINTING CO., LTD.
- Shigeki Chujo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Manufacturing Electroconductive Material-Filled Throughh...
- Publication number 20080092378
- Publication date Apr 24, 2008
- DAI NIPPON PRINTING CO., LTD.
- Shigeki Chujo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Wiring Board And Method For Manufacturing The Same
- Publication number 20080083558
- Publication date Apr 10, 2008
- DAI NIPPON PRINTING CO., LTD.
- Shigeki Chujo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board and manufacture method thereof
- Publication number 20060185141
- Publication date Aug 24, 2006
- DAI NIPPON PRINTING CO., LTD.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board and manufacture method thereof
- Publication number 20050012217
- Publication date Jan 20, 2005
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Koichi Nakayama

Person

Patents Grantslast 30 patents

Multilayer wiring board

Multilayer wiring board

Method for manufacturing multilayer wiring board

Method for manufacturing multilayer wiring board

Through-hole electrode substrate and method of manufacturing the same

Method for manufacturing electroconductive material-filled throughh...

Through-hole electrode substrate and method of manufacturing the same

Method of manufacturing multilayer wiring board

Method for manufacturing electroconductive material-filled throughh...

Multilayer wiring board

Method of manufacturing a multilayer wiring board

Multilayer wiring board and manufacture method thereof

Patents Applicationslast 30 patents

MULTILAYER WIRING BOARD

METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

THROUGH-HOLE ELECTRODE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

MULTILAYER WIRING BOARD AND MANUFACTURE METHOD THEREOF

METHOD FOR MANUFACTURING ELECTROCONDUCTIVE MATERIAL-FILLED THROUGHH...

THROUGH-HOLE ELECTRODE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

Method For Manufacturing Electroconductive Material-Filled Throughh...

Multilayer Wiring Board And Method For Manufacturing The Same

Multilayer wiring board and manufacture method thereof

Multilayer wiring board and manufacture method thereof