TREA

Koichi Takeyama

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer holding mechanism
    • Patent number 7,557,904
    • Issue date Jul 7, 2009
    • Disco Corporation
    • Naoki Ohmiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser processing apparatus
    • Patent number 7,473,866
    • Issue date Jan 6, 2009
    • Disco Corporation
    • Yukio Morishige
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Laser beam machine with cylindrical lens system
    • Patent number 7,408,129
    • Issue date Aug 5, 2008
    • Disco Corporation
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Laser beam processing machine
    • Publication number 20070109526
    • Publication date May 17, 2007
    • DISCO CORPORATION
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Laser processing apparatus
    • Publication number 20070023691
    • Publication date Feb 1, 2007
    • DISCO CORPORATION
    • Yukio Morishige
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Processing method and apparatus using laser beam
    • Publication number 20060249496
    • Publication date Nov 9, 2006
    • DISCO CORPORATION
    • Hiroshi Morikazu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wafer holding mechanism
    • Publication number 20060203222
    • Publication date Sep 14, 2006
    • Naoki Ohmiya
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR