Koichi Yazima

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Chigasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of dividing a wafer and method of manufacturing a semiconduc...
- Patent number 6,294,439
- Issue date Sep 25, 2001
- Kabushiki Kaisha Toshiba
- Shigeo Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of dividing a wafer and method of manufacturing a semiconduc...
- Patent number 6,184,109
- Issue date Feb 6, 2001
- Kabushiki Kaisha Toshiba
- Shigeo Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing a wafer and method of manufacturing a semiconduc...
- Patent number 5,888,883
- Issue date Mar 30, 1999
- Kabushiki Kaisha Toshiba
- Shigeo Sasaki
- H01 - BASIC ELECTRIC ELEMENTS