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Koichi Yoshida
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Kawasaki, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Apparatus and method for forming bump
Patent number
7,350,684
Issue date
Apr 1, 2008
Matsushita Electric Industrial Co., Ltd.
Shoriki Narita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for forming bump
Patent number
6,910,613
Issue date
Jun 28, 2005
Matsushita Electric Industrial Co., Ltd.
Shoriki Narita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump bonding device and bump bonding method
Patent number
6,481,616
Issue date
Nov 19, 2002
Matsushita Electric Industrial Co. Ltd.
Makoto Imanishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump bonding device and bump bonding method
Patent number
6,328,196
Issue date
Dec 11, 2001
Matsushita Electric Industrial Co., Ltd.
Makoto Imanishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for manufacturing a resin-encapsulated electronic product
Patent number
6,052,893
Issue date
Apr 25, 2000
Matsushita Electric Industrial Co., Ltd.
Koichi Yoshida
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Bump bonding method and bump bonding apparatus
Patent number
6,017,812
Issue date
Jan 25, 2000
Matsushita Electric Industrial Co., Ltd.
Takahiro Yonezawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump bonder with a discard bonding area
Patent number
5,899,375
Issue date
May 4, 1999
Matsushita Electric Industrial Co., Ltd.
Koichi Yoshida
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic circuit substrate
Patent number
5,858,481
Issue date
Jan 12, 1999
Matsushita Electric Industrial Co., Ltd.
Tetsuo Fukushima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid electrolytic capacitors and method for manufacturing the same
Patent number
5,424,907
Issue date
Jun 13, 1995
Matsushita Electric Industrial Co., Ltd.
Toshikuni Kojima
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Apparatus and method for forming bump
Publication number
20050191838
Publication date
Sep 1, 2005
Shoriki Narita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Device and method for forming bump
Publication number
20040102030
Publication date
May 27, 2004
Shoriki Narita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bump bonding device and bump bonding method
Publication number
20020030087
Publication date
Mar 14, 2002
Makoto Imanishi
H01 - BASIC ELECTRIC ELEMENTS