Koichi Yuzaki

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,903,185
- Issue date Jan 26, 2021
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20170077057
- Publication date Mar 16, 2017
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR