Koichiro Ichikawa

Person

Nagano-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing apparatus and method of polishing work
- Patent number 8,333,882
- Issue date Dec 18, 2012
- Fujikoshi Machinery Corp.
- Unkai Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Method of and apparatus for mirror-like polishing wafer chamfer wit...
- Patent number 6,332,828
- Issue date Dec 25, 2001
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method of and apparatus for mirror-like polishing wafer chamfer wit...
- Patent number 6,113,463
- Issue date Sep 5, 2000
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing peripheral portion of wafer
- Patent number 5,928,066
- Issue date Jul 27, 1999
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing peripheral portion of wafer
- Patent number 5,766,065
- Issue date Jun 16, 1998
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing the notch of a wafer
- Patent number 5,733,181
- Issue date Mar 31, 1998
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method for mirror-polishing chamfered portion of wafer and mirror-p...
- Patent number 5,727,990
- Issue date Mar 17, 1998
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing the periphery portion of a wafer
- Patent number 5,476,413
- Issue date Dec 19, 1995
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing notch portion of wafer
- Patent number 5,458,529
- Issue date Oct 17, 1995
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus for notch portion of wafer
- Patent number 5,429,544
- Issue date Jul 4, 1995
- Shin-Etsu Handotal Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
WAFER HEAD TEMPLATE FOR CHEMICAL MECHANICAL POLISHING AND A METHOD...
- Publication number 20100112905
- Publication date May 6, 2010
- Leonard Borucki
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND APPARATUS FOR DETERMINING SHEAR FORCE BETWEEN THE WAFER...
- Publication number 20100099333
- Publication date Apr 22, 2010
- Fransisca Maria Astrid Sudargho
- B24 - GRINDING POLISHING
Information Patent Application
Polishing apparatus and method of polishing work
- Publication number 20070108067
- Publication date May 17, 2007
- Fujikoshi Machinery Corp.
- Unkai Sato
- B24 - GRINDING POLISHING

Koichiro Ichikawa

Person

Patents Grantslast 30 patents

Polishing apparatus and method of polishing work

Method of and apparatus for mirror-like polishing wafer chamfer wit...

Method of and apparatus for mirror-like polishing wafer chamfer wit...

Apparatus for polishing peripheral portion of wafer

Apparatus for polishing peripheral portion of wafer

Apparatus for polishing the notch of a wafer

Method for mirror-polishing chamfered portion of wafer and mirror-p...

Apparatus for polishing the periphery portion of a wafer

Apparatus for polishing notch portion of wafer

Polishing apparatus for notch portion of wafer

Patents Applicationslast 30 patents

WAFER HEAD TEMPLATE FOR CHEMICAL MECHANICAL POLISHING AND A METHOD...

METHOD AND APPARATUS FOR DETERMINING SHEAR FORCE BETWEEN THE WAFER...

Polishing apparatus and method of polishing work